System-In-A-Package Market Key Players & Growth Rate and Forecasts to 2029

System in Package Market size was valued at US$ 8.55 Bn. in 2021 and the total revenue is expected to grow at a CAGR of 9.8% through 2021 to 2029, reaching nearly US$ 18.07 Bn.

System in Package Market Overview:

System in Package (SiP) technology was created for a variety of advanced packaging applications that called for a fully working, highly specialised module. SiP is a technology that combines numerous integrated circuits into a single package or module. The integrated circuits can be stacked vertically on a substrate, and two or more ICs can be packaged together in a single container.

System in Package Market Dynamics:

The demand for reliable and small electronic equipment has grown due to the rapid R&D and technical advancements. Due to this reason, the need for smaller electrical devices is increasing. With the advancement of semiconductor technology, most electronic products have become more advanced, requiring the usage of IC packaging technologies in logic, memory, RF, and sensors to be integrated into compact form factors. The SiP provides high-performance and low-power solutions in a compact package. In addition, by managing the cycle duration and energy dissipation, the reduction in wire length in SiP helps to improve circuit performance and minimise power consumption.

The SiP technique allows for the interference-free integration of many multichip modules, such as DRAM and others. Due to this reason, the growing use of IC packaging technology in small form factors for the production of miniaturised electronic devices is boosting the market for this system. These are the major key factors that are expected to drives the growth of the global market during the forecast period 2021-2029.

SiP allows for extremely deep multilayer integration in a small footprint. While this is appealing for many applications where nanotechnology is a consideration, it also poses thermal management issues. High on-chip temperature is caused by increased integration. There was an issue with overheating during the manufacture of 3D ICs with TSVs. When the temperature rises, the threshold voltage drops, and mobility suffers. Because metal makes up the majority of the component, the resistance and power dissipation increase. The resistance of the wires increases as well, resulting in longer connection delays. Higher power densities and greater thermal resistance along heat dissipation routes generate more pronounced thermal impacts in 3D IC. Due to this, the system's progress in the package market is restricted by thermal difficulties.

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Global System-in-a-package Market: Segmentations

Global System-in-a-package Market: Major Players
Samsung Electronics Co Ltd.
Fujitsu Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd.
Amkor Technology Inc.
Powertech Technologies Inc.
ChipMOS Technologies Inc.
Qualcomm Incorporated
Toshiba Corporation
ASE Group
Renesas Electronics Corporation

Global System-in-a-package Market: By Types
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging

Global System-in-a-package Market: By Applications
Consumer Electronics
Auto Mold equipment
Telecommunication
Industrial System
Aerospace & Defense
Others

Global System-in-a-package Market: Regional Analysis
The countries covered in the regional analysis of the Global System-in-a-package market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.

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