Radiation-Hardened Electronics Market is expected to reach US$ 2,045.04 million by 2028

Increasing Investment in Product Development by Major Players to Provide Growth Opportunities for Radiation-Hardened Electronics Market during 2021-2028

According to our new research study on "Radiation-Hardened Electronics Market Forecast to 2028 - COVID-19 Impact and Global Analysis - by Component, Manufacturing Technique, and Application," the market is expected to grow from US$ 1,520.86 million in 2021 to US$ 2,045.04 million by 2028; it is estimated to grow at a CAGR of 4.3% from 2021 to 2028.

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The List of Companies - Radiation-Hardened Electronics Market:
BAE Systems
Data Device Corporation
Honeywell International Inc.
Infineon Technologies AG
Renesas Electronics Corporation
Texas Instruments Incorporated
STMicroelectronics
Xilinx, Inc. (AMD)
VORAGO Technologies
Microchip Technology Inc.

The radiation-hardened electronics manufacturers are engaged in various processes, including designing, assembling, and production, to transform the raw material into finished products and integrate the components into the devices. Texas Instruments Microchip Technologies and Vorago Technologies are a few of the leading global radiation-hardened electronics manufacturers. These companies offer high-quality radiation-hardened electronics and systems, which finally install the product in aircraft and satellites, with end-users ranging from aircraft manufacturers buyers to large fleet operators.

Rising Adoption of Radiation-Hardened Electronics Market

Over the years, satellites have experienced high adoption across various industries such as communication, networking, television broadcast, and space-based surveillance. The satellites are prone to solar flares, which leads to system failures. This influences the adoption of radiation-hardened electronics across the end-use industries such as aerospace & defense, nuclear power plants, and space. A few of the major procurement of radiation-hardened electronics across the globe are mentioned below:

The European Space Agency (ESA) granted CAES, a leader in advanced mission-critical electronics, a contract to create a fault- and radiation-tolerant system-on-chip in December 2021. The project, which the Swedish National Space Agency funds, will develop a 16-core, space-hardened microprocessor based on the open RISC-V instruction set architecture to improve performance and power efficiency in satellite and spacecraft applications (ISA).

Alphacore Inc. was awarded a Phase I contract by NASA in April 2021 to develop single-chip DC-DC converters for harsh environments. It plans to build a digitally regulated, high switching rate, digital hysteresis-based DC-DC converter for use in space and extreme environments. The company is currently developing the product, which will contain features, including support for up to 4.5V input supply and 4A load current, a 10MHz switching rate, a digital slow-start (SS) option, and digitally controlled regulation loop parameters.

The US government awarded Silicon Technologies Inc. (STI) a 2-year contract in July 2019 to create Radiation Hardened by Design (RHBD), Process Portable, and Mixed Signal Design IP. The primary goal of this arrangement was to increase the US government's access to radiation-hardened equipment. This arrangement is for radiation-hardened electronic prototype demonstrations for new electronic component solutions to support strategic and space missions by the US government.

The biggest threat to satellites is radiation generated from solar flares, resulting in system failures. Due to the lack of air protection, these satellites are vulnerable to solar flares. As a result, radiation hardening is required to withstand space radiation while protecting electronic components. Furthermore, electrical components used in space activities are manufactured with a life expectancy of at least 15 years without failure. High-energy particles in space destroy the electronics. These reasons influence the global space industry to adopt radiation-hardened electronics, further boosting the radiation-hardened electronics market growth.

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The radiation-hardened electronics market players are engaged in various processes, including designing, assembling, and production, to transform the raw material into finished products and additionally integrating the components to the entire devices. Texas Instruments Microchip Technologies, Vorago Technologies are some of the leading global radiation-hardened electronics manufacturers. These companies are offering high quality radiation-hardened electronics and systems to, which finally install the product in aircrafts and satellites

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This release was published on openPR.