Thin Wafer Processing and Dicing Equipment Market is Estimated to Reach USD 13.00 Million by 2030: Cognitive Market Research

Thin Wafer Processing and Dicing Equipment Market Overview
- Thin wafer processing and dicing equipment are used in the production of thin wafers. The integration of different microelectronics into various consumer electronics and smart cards requiring thinner wafers is growing rapidly. Technologies such as MEMS devices, power devices, and RFID are considered to be the main sources of thin wafers.

Summary:
• Global Thin Wafer Processing and Dicing Equipment Market Size Is Estimated to Reach USD 13.00 Million by 2030 to Grow at A CAGR Of 5.19 % During the Forecast Period 2023-2030- Report by Cognitive Market Research
• The dicing equipment segment has the largest dominant revenue share in the thin wafer processing and dicing equipment market.
• The memory and Logic segment holds the major revenue share in terms of application.
• Asia Pacific has the largest dominant revenue share in the thin wafer processing and dicing equipment market.

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Market Dynamics:
- Increasing demand for high-performance integrated circuits and developments in semiconductor technology are major factors driving the growth of the thin wafer processing and dicing equipment market. Furthermore, the wafers' high-quality flat surface is the main reason for increasing integration into processing, and investments in wafer enhancement created opportunities for the thin wafer processing and dicing equipment market. However, the increasing cost of the manufacturing process may restrain the growth of the thin wafer processing and dicing equipment market.

Market Segementation:
- The dicing equipment segment holds the major revenue share in terms of type
The dicing equipment segment has the largest dominant revenue share in the thin wafer processing and dicing equipment market. This is attributed to dicing the round wafers are typically mounted on dicing tape to ensure the fixed position of the wafer on the very thin metal sheet frame. The task of the wafer dicing machines is to cut wafers into individual semiconductor chips with blades.

- The memory and Logic segment holds the major revenue share in terms of application
The memory and logic segment has the largest dominant revenue share in the thin wafer processing and dicing equipment market. This is due to the widespread adoption of low-cost cloud computing solutions, and the increasing implementation of server and data center systems across a variety of businesses and industries are expected to drive the demand for logic devices like microprocessors and digital signal processors.

- Top Companies that hold a market share in Thin Wafer Processing and Dicing Equipment: EV Group, Lam Research Corporation, DISCO Corporation, Plasma-Therm, Tokyo Electron Ltd, Advanced Dicing Technologies, SPTS Technologies, Suzhou Delphi Laser, Panasonic, Tokyo Seimitsu.

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Asia Pacific accounted for the largest share of the thin wafer processing and dicing equipment market
- Asia Pacific has the largest dominant revenue share in the thin wafer processing and dicing equipment market, due to increasing demand for smartphones and other electronic devices and manufacturing facilities in China, the Republic of Korea, and Singapore.

News:
- DISCO has announced a new automatic grinder
In December 2022, DISCO Corporation has developed DFG8541, a fully automatic grinder that can process Si (silicon) and SiC (silicon carbide) wafers up to a maximum size of 8 inches.
UTAC has the acquisition of Singapore wafer bumping assets from Powertech Technology (Singapore) Pte. Ltd.

- In January 2021, UTAC Holdings Ltd. has completed the acquisition of Singapore wafer bumping assets from Powertech Technology (Singapore) Pte. Ltd in order to facilitate the smooth transfer of the wafer bumping-related operations to UTAC, UTAC has entered into a number of ancillary agreements with Powertech Technology Inc. as part of the transaction.

Table of Content (Revenue USD Edition), (Enquire about Volume/Consumption Edition Data)
Chapter 1 Industrial Insight and Market Scope
• 1.1 Global Thin Wafer Processing and Dicing Equipment Industry Introduction
• 1.2 Objectives of the Study
• 1.3 USP of the Report
• 1.4 Who is this report for?
• 1.5 Designing of Market Scope
1.5.1 Segmentation
1.5.1 Regional Fragmentation
1.5.1 Market Players
• 1.6 Report Duration
Chapter 2 Research Methodology
Chapter 3 Executive Summary
Chapter 4 Global Thin Wafer Processing and Dicing Equipment Market Overview
Chapter 5 Competitive Analysis (Subject to Availability)
Chapter 6 Qualitative Analysis
Chapter 7 Company Profiling (Subject to Availability)
Chapter 8 Global Thin Wafer Processing and Dicing Equipment Market by Type Segmentation Analysis (2018-2030)
Chapter 9 Global Thin Wafer Processing and Dicing Equipment Market by Application Segmentation Analysis (2018-2030)
• 9.1 Detailed Qualitative Analysis
• 9.2 Global Thin Wafer Processing and Dicing Equipment Revenue and Share (%) by Application (2018-2030)
9.2.1 MEMS
9.2.1.1 Global MEMS Market Share and Revenue (USD Million) for 2018-2030
9.2.2 RFID
9.2.2.1 Global RFID Market Share and Revenue (USD Million) for 2018-2030
9.2.3 CMOS Image Sensor
9.2.3.1 Global CMOS Image Sensor Market Share and Revenue (USD Million) for 2018-2030
9.2.4 Others
9.2.4.1 Global Others Market Share and Revenue (USD Million) for 2018-2030
Chapter 10 Global Thin Wafer Processing and Dicing Equipment Market Regional Analysis
Chapter 11 North America Thin Wafer Processing and Dicing Equipment Market Outlook (2018 - 2030)
Chapter 12 Europe Thin Wafer Processing and Dicing Equipment Market Outlook (2018 - 2030)
Chapter 13 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Outlook (2018 - 2030)
Chapter 14 Latin America Thin Wafer Processing and Dicing Equipment Market Outlook (2018 - 2030)
Chapter 15 Middle East and Africa Thin Wafer Processing and Dicing Equipment Market Outlook (2018 - 2030)
Chapter 16 Research Findings
Link for TOC: https://www.cognitivemarketresearch.com/thin-wafer-processing-and-dicing-equipment-market-report#table_of_contents

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