Advanced Packaging Market is expected to reach USD 66.68 billion by 2029 : Cognitive Market Research

As per Cognitive Market Research analysis, the global advanced packaging market size was valued at USD 29.10 billion in 2021 and is expected to grow at a CAGR of 10.92% during the forecast period, reaching USD 66.68 billion by 2029.

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Advanced packaging can help achieve great performance through the integration of several devices in one package. Advanced packaging comes in many packaging forms, ranging from the traditional single-die chip or flip-chip with wire bonding to advanced products integrating multiple chipsets in a modular manner. Advanced packaging for semiconductors has focused on a variety of methods for expanding functionality and has created the modular chip packaging design. The rapid expansion of the semiconductor industry and acceleration in the adaptation of electronic devices such as smartphones, and wearable devices are some key factors that boost the growth of the advanced packaging market over the forecast period. Additionally, the market is growing due to the cost efficiency of advanced packaging technologies which is anticipated to the growth of the advanced packaging market during the forecast period. For example, wafer-level packaging is in high demand due to the fact that it includes the need to reduce package size and height, streamline the supply chain, and reduce overall costs. However, fierce competition in the advanced packaging industry might hamper the growth of this market. Furthermore, future innovations in advanced electronics technologies will offer great opportunities during the forecast period.

Regional Analysis of the Advanced Packaging Market:
• Asia Pacific accounted for relatively the largest share of the advanced packaging market. The market demand is growing in the region due to the rapid expansion of IC packaging technologies and initiatives taken by the government to build the overall semiconductor ecosystem. For example, In China, the government has committed USD 150 billion by the end of 2030 to build a thriving domestic integrated circuit (IC) ecosystem.

Top players involved in the Global Advanced Packaging market:
- The global Advanced Packaging market involves key players such as
• Amkor Technology
• Siliconware Precision Industries Co. Ltd. (SPIL)
• STATS ChipPAC Pte. Ltd.
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• SSS MicroTec AG.
• International Business Machines Corporation (IBM)
• Intel Corporation
• Qualcomm Technologies Inc.
• Taiwan Semiconductor Manufacturing Company
• Advanced Semiconductor Engineering Inc.
• Chipbond Technology Corporation
• Others.

News
• Intel detailed new chip packaging design
In August 2022; Intel released information about its new tile-based chip packaging design at Hot Chips. The new design has been used in Intel's upcoming Meteor Lake, Arrow Lake, and Lunar Lake processors. Chiplet-based CPUs have a modular design that incorporates multiple smaller dies to create a single CPU package. Advanced packaging technologies such as Intel's EMIB and Foveros usher in a new era in chipmaking expanding its functional capabilities.

Segment Analysis:
• Based On The Type, the market is segmented into the flip chip, flip-chip, fan-in WLP, fan out, and 2.5D/3D. Flip chip is expected to hold the largest market share in terms of type. A flip chip refers to the method of electrically connecting the die to the package carrier. The flip chip connection is generally formed one of two ways by using solder or using conductive adhesive.

• Based On The Industry Vertical, the market is segmented into consumer electronics, automotive, aerospace & defense, healthcare, and others. Consumer electronics is dominating the segment in terms of industry verticals on account that the consumer electronics industry is growing at a rapid pace. Consumer electronics manufacturers need powerful and connected packaging solutions to improve their brand image. And it's also vital to consider the sustainability of the packaging.

Related Report:
• Advanced Packaging Equipment Market - https://www.cognitivemarketresearch.com/Ic-advanced-packaging-equipments-market-report
• Packaging Market - https://www.cognitivemarketresearch.com/packaging-market-report
• Packaging Materials Market - https://www.cognitivemarketresearch.com/Packaging-Materials-market-report
• Food Packaging Market - https://www.cognitivemarketresearch.com/Food-Packaging-market-report

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Cognitive Market Research has evolved as one leading market research and consulting firm and it provides services across multiple domains. Cognitive Market Research gathers and analyzes data about customers, competitors, distributors, and other market actors and forces operational across the value chain. As a market research company, we follow a complete process of gathering information about the target market and end-use industries to verify the complete journey of the product or service in the global market. It helps our readers understand the demand and viability of their product/service and how it might perform in the real world and help them to build business strategies accordingly.

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