Global Radiation-Hardened Electronics for Space Application Market Research Report 2023-2029: Detailed Analysis of Recent Trends and Perspectives on Industry Sizing, Dynamics, and Opportunities

Highlights
The global Radiation-Hardened Electronics for Space Application market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

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North American market for Radiation-Hardened Electronics for Space Application is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Radiation-Hardened Electronics for Space Application is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for Radiation-Hardened Electronics for Space Application in Satellite is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Radiation-Hardened Electronics for Space Application include 3D Plus, Analog Devices, Inc., Apogee Semiconductor, Cobham Plc, Data Device Corporation, Exxelia, General Dynamics, GSI Technology, Inc. and Infineon Technologies, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Radiation-Hardened Electronics for Space Application, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Radiation-Hardened Electronics for Space Application.
The Radiation-Hardened Electronics for Space Application market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Radiation-Hardened Electronics for Space Application market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Radiation-Hardened Electronics for Space Application companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.

By Company
- 3D Plus
- Analog Devices, Inc.
- Apogee Semiconductor
- Cobham Plc
- Data Device Corporation
- Exxelia
- General Dynamics
- GSI Technology, Inc.
- Infineon Technologies
- Mercury Systems, Inc.
- Microchip Technology, Inc.
- Micropac Industries
- Renesas Electronics Corporation
- Solid State Devices, Inc.
- STMicroelectronics N.V.
- Teledyne Technologies
- Texas Instruments
- Vorago Technologies
- Xilinx, Inc.

Segment by Type
- Silicon Material
- Gallium Nitride Material
- Silicon Carbide Material
- Others

Segment by Application
- Satellite
- Launch Vehicle
- Deep Space Probe
- Others

By Region
- North America
- - United States
- - Canada
- Europe
- - Germany
- - France
- - UK
- - Italy
- - Russia
- - Nordic Countries
- - Rest of Europe
- Asia-Pacific
- - China
- - Japan
- - South Korea
- - Southeast Asia
- - India
- - Australia
- - Rest of Asia
- Latin America
- - Mexico
- - Brazil
- - Rest of Latin America
- Middle East & Africa
- - Turkey
- - Saudi Arabia
- - UAE
- - Rest of MEA

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This release was published on openPR.