Solder Materials Market | Key players operating in the market include Fusion Inc., Henkel, Indium Corporation, Tamura Corporation, Koki Company Limited

The global Solder Materials Market is projected to grow from USD 4.1 billion in 2022 to USD 4.9 billion by 2027, at a CAGR of 3.8% from 2022 to 2027. A solder is a fusible metal alloy usually made of tin and lead which is melted using a hot iron. The iron is heated to temperatures above 600 degrees fahrenheit which then cools to create a strong electrical bond. The growth of the market is attributed to growing consumer electronics and automotive industry.

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On the basis of type the market is segmented into lead-free and with lead.  Lead-free segment account for greater market share than with lead segment during the forecast period. This is attributed to the solder material consumption shift from with lead to lead free to eradicate lead from electronic production and waste recycling processes.

On the basis of product the market is segmented into bar, wire, paste, flux, and others. Solder bar is most used product type in electronic manufacturing and assembly with wave soldering process. It is used more to ascertain automated, faster, and reliable soldering process in commercial production of electronic products.

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Asia Pacific is the largest market in the global solder materials market during the forecast period. The large market share in Asia Pacific region is attributed to the high-paced industrial growth and urbanization in the emerging economies of the region. China is expected to lead the solder materials market in the region. This is due to the government investments to strengthen country's electronics industry.

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A few of the key players in the solder material market are Lucas Milhaupt Inc.(US), Fusion Inc. (US), Henkel (Germany), Stannol Gmbh & CO. KG (Germany), Senju Metal Industries. Co. Ltd. (Japan), Element Solutions, Inc. (US), Indium Corporation (US), Tamura Corporation (Japan) and Koki Company Limited (Japan)among others.

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