Copper Wire Bonding Market to Witness Staggering Growth by 2028

Copper wire bonding market is anticipated to grow at a significant CAGR during the forecast period. Copper wire bonding is a wire bonding procedure in semiconductor packaging that uses copper wire instead of aluminium or gold wires in standard semiconductor packaging. Copper wire bonding began to appear in low-cost consumer-grade in 2018, eventually replacing gold wire bonding due to lower cost optimization. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market.

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Copper wire bonding is also utilised in a variety of applications across many industry verticals, including healthcare, military and defence, consumer electronics, automotive, aviation, and a few others. This has resulted in growing demand from manufacturers, which is driving the global copper wire bonding market growth over the forecast period. Copper wire bonding is also used in harsh environment applications because of their superior electrical and thermal conductivity, which enhance performance. 

With rising market rivalry, both regional and global competitors are working on developing new items to maintain and strengthen their market position. To obtain an advantage over their competitors, major firms are focusing on merger and acquisition activity as well as technical development.For instance,  In India, the government has initiated projects such as 100 smart cities and 'Housing for All by 2022' which are expected to immensely drive the copper wire bonding  market in India through the forecast period. 

Market Coverage: 

The market number available for - 2021-2028
The base year - 2021
The forecast period is from 2022 to 2028

Segment Covered- 

By Type
By Application

Regions Covered 

North America
Europe
Asia-Pacific
Rest of the Word
Competitive Landscape: Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution.

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Copper Wire Bonding Market, 

By Type

0-20 um
20-30 um
30-50 um
Above 50 um

By Application

Semiconductor Packaging
PCB
Others

Global Copper Wire Bonding Market by Region 

North America

United States
Canada

Europe

UK
Germany
Spain
France
Italy
Rest of Europe

Asia-Pacific

India
China
Japan
South Korea
Rest of APAC

Rest of the World

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