Press release
Global Advanced IC Substrates Market Size Is Set To Fly High In Years To Come
Highlighted with 82 tables and 82 figures, this 165-page report Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity. is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications.
Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
Market Structure
Growth Drivers
Restraints and Challenges
Emerging Product Trends & Market Opportunities
Porters Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.
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Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
Based on Packaging Type
FC BGA
FC CSP
Other Packaging Types
Based on Material Type
Rigid Integrated Circuit Substrate
Flex Integrated Circuit Substrate
Ceramic Integrated Circuit Substrate
By Manufacturing Method
Subtraction Process (SP)
Addition Process (AP)
Modified Semi-additive Process (MSAP)
By Bonding Technology
Wire Bonding
FC Bonding
Tape Automated Bonding (TAB)
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By Application
Mobile and Consumer Electronics
Automotive and Transportation
IT and Telecom
Other Applications
Geographically
North America (U.S., Canada, and Mexico)
Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
South America (Brazil, Chile, Argentina, Rest of South America)
MEA (UAE?Saudi Arabia? South Africa and Rest of MEA)
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