Press release
Outsourced Semiconductor Assembly and Test Market Share, Size, Forecast and Trends 2029
Outsourced Semiconductor Assembly and Test Market - DataM Intelligence
The Outsourced Semiconductor Assembly and Test Market are expected to grow at a CAGR of 3.6% during the forecast period 2022-2029.
Outsourced Semiconductor Assembly and Test are known as OSAT. This third-party service is provided by vendors worldwide and includes, as the name suggests, semiconductor assembly, packaging and IC testing (Integrated Circuits). Because they serve as the link between semiconductor foundries and consumers, OSAT providers are more crucial in the semiconductor business than ever.
OSATs are business vendors. Integrated device manufacturers (IDMs) and foundries with internal packaging operations also contract with OSATs for a portion of their IC packaging needs. The OSATs and foundries handle packaging for the fabless firms. OSAT firms are hired by semiconductor design firms like Intel, AMD, Nvidia, etc., and carry out those companies' designs.
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Market Dynamics
The rising usage of outsourced semiconductor assembly and test (OSAT) in automotive
The Human Machine Interface is receiving more attention and value due to increased technological developments like improved connection and vehicle automation. Therefore, automakers are progressively creating vehicles with integrated infotainment systems that offer a balance of entertainment and information for an improved in-vehicle experience to create comfortable, safe, and smart vehicles. The market for OSAT will be driven by rising vehicle production during the ensuing few years.
The use of safety related electronic systems in the automotive industry has increased significantly. Microcontrollers, sensors, and memory are a few of the semiconductor components that will increase demand in the automotive industry. In the coming 10 years, automotive electronics and subsystems will contain more semiconductors due to automation, electrification, digital connection, and security. Consequently, fostering expansion in the global OSAT market during the anticipated period.
View Full Report: https://www.datamintelligence.com/research-report/outsourced-semiconductor-assembly-and-test-market
Market Segmentation:
By Service
• Packaging
• Testing
By Type of Packaging
• Ball Grid Array (BGA)*
• Chip-Scale Package (CSP)
• Stacked Die
• Multi-Package
• Quad and Dual
By Application
• Automotive
• Networking and Communication
• Consumer Electronics
Major Companies
Major global outsourced semiconductor assembly and test (OSAT) market companies include ASE Technology Holding Co., Ltd, Amkor Technology, Inc., Powertech Technology Inc., ChipMOS TECHNOLOGIES INC., King Yuan Electronics Co Ltd., Formosa Advanced Technologies Co., Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., UTAC Holdings Ltd., Lingsen Precision Industries Ltd., TongFu Microelectronics, Hana Micron and Tianshui Huatian Technology Co., Ltd.
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