Hybrid Memory Cube (HMC) Market Analysis, Size, Current Scenario and Future Prospects

HMC market is anticipated to grow at a considerable CAGR of 24.6% during the forecast period. HMC is a memory architecture, developed by Micron in 2011. It was developed in response to the high-bandwidth, high-efficiency memory requirements of multi-core processing in supercomputing and advanced network systems. It reduces latency, increases bandwidth, and offers efficient power, a smaller physical footprint, along with built-in reliability. As a result, HMC finds extensive applications in enterprise storage, telecommunications, and networking. These are used in the fields of consumer electronics and high-performance computing. The growth in the end-use application of the technology is expected to significantly drive the market globally. Initially, HMCs were used in supercomputers and high-speed servers; however, HMC memory is expected to migrate to all types of computing devices. 

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Moreover, HMC consumes less energy-per-bit than conventional DRAM-based memory systems. This, coupled with the rising utilization of big data applications, such as business analytics, scientific computing, financial transactions, and social networking globally, is propelling the growth of the market. Hybrid memory cube memory provides 15 times more bandwidth than conventional DDR3 DRAM modules and draws 70% less energy.

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Hybrid Memory Cube Market Segmentation

By End-user Industry

Enterprise Storage
Telecommunications and Networking
Other End-user Industries
By Application
High-Performance Computing (HPC)
Networking
Data Centres
Graphics

Regional Analysis           

North America                                                                                                           

United States
Canada

Europe

UK
Germany
Spain
France
Italy
Rest of Europe

Asia-Pacific

India
China
Japan
South Korea
Rest of APAC

Rest of the World

Latin America
Middle East and Africa 

Company Profiles 

Advanced Micro Devices, Inc. (Xilinx)
Altera Corp.
Cadence Design Systems, Inc.
Fujitsu Ltd.
IBM Corp.
Intel Corp.
Micron Technology, Inc. 
Open Silicon Inc. (SiFive)
RAMBUS
Samsung Electronics Co. Ltd.
Semtech Corp.

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