Organic Substrate Packaging Material Market Report 2022-2027, Size, Share, Growth, Trends and Forecast

According to IMARC Group's latest report, the global organic substrate packaging material market reached a value of US$ 13.9 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 18.2 Billion by 2027, exhibiting at a CAGR of 4.5% during 2022-2027

We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.

Organic substrate packaging materials are the base materials that are utilized on the foundation layer of printed circuit boards (PCBs) to provide high reliability and enhanced electrical performance. Small outline (SO) packages, grid array (GA) packages, flat no-leads packages, quad flat package (QFP), dual in-line package (GIP), etc., are some of the common variants of organic substrate packaging materials. They are widely adopted across diverse industries, such as consumer electronics, automotive, manufacturing, healthcare, etc.

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Market Trends

The rising demand for semiconductor packaging due to the increasing adoption of portable electronic devices is primarily driving the market for organic substrate packaging materials. Furthermore, the growing popularity of miniaturized electronic devices across the healthcare, aviation, and military and defense sectors is also catalyzing the market growth. Moreover, the emergence of autonomous vehicles has augmented the use of organic substrate packaging materials in millimeter-wave automotive radar systems to detect obstacles. Additionally, the introduction of high-density, ultra-thin organic substrates with higher performance rate will continue to the drive the market for organic substrate packaging materials in the coming years.

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List of Key Companies Covered in this Market Report:

Amkor Technology Inc.
ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)
Compass Technology Co. Ltd.
Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)
Kyocera Corporation
Mitsubishi Corporation
NGK Spark Plug Co. Ltd.
Shinko Electric Industries Co. Ltd. (Fujitsu)
STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.)
WUS Printed Circuit Co. Ltd.

Breakup by Technology:

Small Outline (SO) Packages
Grid Array (GA) Packages
Flat no-leads Packages
Quad Flat Package (QFP)
Dual in-line Package (GIP)
Others

Breakup by Application:

Consumer Electronics
Automotive
Manufacturing
Healthcare
Others

Breakup by Geography:

North America (U.S. & Canada)
Europe (Germany, United Kingdom, France, Italy, Spain, Russia, and Others)
Asia Pacific (China, India, Japan, South Korea, Indonesia, Australia, and Others)
Latin America (Brazil, Mexico)
Middle East & Africa

Key highlights of the report:

Market Performance (2016-2021)
Market Outlook (2022- 2027)
Porter's Five Forces Analysis
Market Drivers and Success Factors
SWOT Analysis
Value Chain
Comprehensive Mapping of the Competitive Landscape

If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.

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