[14.5% CAGR] Molded Interconnect Devices Market to hit USD 2.71 Billion by 2028

Molded interconnect devices or MIDs are injection-molded thermoplastic parts with an integrated electronic circuit, which helps reduce the circuit density by integrating fewer auxiliary components, the associated complexities, and the failure ratio. The components of MIDs are molded with circuits with the help of structured metallization and high-temperature thermoplastics. This leads to the opening of new dimensions of carrier circuit design in the electronics industry. As a result of these aforementioned features, the demand for MIDs has increased among electronic device manufacturers to integrate more electronic components into lesser space. Further, the proliferation of AI and IoT technology in computing devices and smart wearables, such as smart watches, will accelerate the growth of the Molded Interconnect Device Market during the forecast period.

Molded Interconnect Devices Market Forecast to 2028 - Covid-19 Impact and Global Analysis by Product (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting Systems, and Others), End-users [Automotive, Consumer Electronics, Medical, Telecommunications, Military and Aerospace, and Others], Process [Laser Direct Structuring (LDS), Two-Shot Molding, and Film Techniques], and Geography

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The adoption of IoT devices and increasing demand for smartphones are likely to create beneficial opportunities for the growth of the Molded Interconnect Device Market in the coming years. However, the fluctuating prices of raw materials can hamper the Molded Interconnect Device Market growth. Various other factors, such as the impact of the COVID-19 pandemic, the ongoing Russia-Ukraine war, and the technological monopoly of LDS equipment manufacturers, are also anticipated to impact the supply chain and hinder the Molded Interconnect Device Market growth.

MARKET PLAYERS

The reports cover key developments in the molded interconnect devices market. Various companies are focusing on organic growth strategies such as product launches, product approvals, patents, and events. Inorganic growth strategies such as acquisitions, partnerships, and collaborations have encouraged the expansion of business and the customer base of market players. The market players are anticipated to experience lucrative growth opportunities in the coming years with the rising demand for MIDs. The list of a few companies engaged in the molded interconnect devices market is mentioned below:

Top Companie mentioned are - Arlington Plating Company, HARTING Technology Group, LPKF Laser and Electronics AG, MacDermid, Inc., Molex, LLC, Multiple Dimensions AG, RTP Company, TE Connectivity, TEPROSA GmbH, YOMURA

Many players are following organic and inorganic growth strategies, such as product launches, product developments, market expansion, partnerships, collaborations, and mergers and acquisitions, to remain competitive in the Molded Interconnect Device Market . A few of the examples are mentioned below:

- In March 2022, Amphenol Corporation expanded its product series, i.e., the SURLOK Plus Series, to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC for meeting the requirement of high-power connection and transfer and energy storage.
- LPKF Laser & Electronics developed a new technology in November 2021 by combining Laser Direct Structuring (LDS) and laser plastic welding. In the LDS process, the electrical circuits are directly placed on parts with fine resolution in 2D and 3D design.
- In June 2020, MacDermid Alpha Electronics Solution announced the launch of Systec SAP, a family of high-performance build-up processes for IC substrate RDL. It provides multiple process flows for various materials and advancements in conditioning, activation, and metallization steps.

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