Thin wafer market is Anticipated to Witness a Promising Growth during the forecast period 2020-2027 | Size, Growth, Share & Industry Report

Thin wafer market

The Thin Wafer Market is expected to expand at a significant CAGR over the forecast period (2020-2027).

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The factors driving the growth of Thin Wafer Market includes growing demand for health monitoring devices, rise in the smartphone users around the world, increasing popularity of e-learning platforms and proliferation of smart wearable devices. According to the report published by Statista, the smartphone users in India were estimated around 748 million in 2020 and are expected to reach 1.5 billion by the end of 2040, which will accelerate the Thin Wafer Market size in the approaching years. Moreover, growing adoption of advanced technologies such as Artificial Intelligence (AI) and Internet of Things (IoT) in the Automotive industry, advancements in the nanotechnology, availability of ultra-thin variety of semiconductors and increasing application of thin wafer in the LEDs and RF, are some of the additional factors supplementing the market growth. In addition, the increasing investments by major corporations on research and development, rising disposable incomes and rapid urbanization, are further contributing towards the market growth.

However, the growth of Thin Wafer Market is hindered attributed to low light absorption capabilities of thin wafers.

The prominent players operating in the market are Lintec Corporation, DISCO Corporation, 3M, SK Siltron Co., Ltd., Shin-Etsu Chemical Co., Ltd., Siltronic, Applied Materials, Inc., Nissan Chemical Corporation, SUMCO CORPORATION and Globalwafers Co. Ltd., among others.

Based on Technology, the Wafer Dicing segment is predicted to grow at a remarkable CAGR during the forecast period 

Growing demand for high-speed dicing with high breakage strength along with increasing use of wafer dicing technology in memory and power devices, are some of the factors responsible for the growth of the segment.

Based on Wafer Size, the 300 mm segment is projected to expand at a robust CAGR over the forecast period

Increasing application of 300 mm thin wafers by the LED manufacturers, is propelling the growth of the segment.

Based on Region, the Asia-Pacific region is anticipated to hold the highest market share during the forecast period

Rapid growth in the semiconductor industry, growing demand for smart home wearable devices, rising adoption of high end-consumer electronic devices, increasing disposable incomes, improvements in the living standards and high population growth rates, are some of the important factors augmenting the market growth in Asia-Pacific.

Key Developments

In 2020, Siltronic, planned to invest in epitaxial reactor to enhance the production capacity of GAN-on-Si wafers portfolio to cater the increasing demand for such wafers in applications such as data centers and 5G networks. The GAN technology will further support the efficient energy distribution under high power densities
In 2020, SK siltron Co., Ltd., completed the acquisition of DuPont's Silicon Carbide Wafer unit worth USD 450 million, this acquisition will help the company to cater the growing demand from consumers and government bodies for sustainable energy and environmental solutions.
In February 2020, GlobalWafers Co., Ltd. and GLOBALFOUNDRIES (US), signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300 mm SOI wafers. This agreement is anticipated to strengthen the company's 300-mm SOI wafer manufacturing capabilities

Market Segmentation

Segmentation by Process

Temporary Bonding & Debonding
UV-Release Adhesives
Thermal-Release Adhesives
Solvent-Release Adhesives
Carrier-less Approach (Taiko Process)

Segmentation by Application

MEMS
CIS
Memory
RF Devices
LED
Interposers
Logic
Others

Segmentation by Wafer Size

125 mm
200 mm
300 mm

Segmentation by Technology

Wafer Grinding
Wafer Polishing
Wafer Dicing

Segmentation by Region

Asia Pacific
China
Japan
India
Rest of APAC

North America
United States of America
Canada

Europe
United Kingdom
Germany
France
Spain
Rest of Europe

RoW
Brazil
South Africa
Saudi Arabia
UAE

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This release was published on openPR.