Press release
Silicon Wafer Reclaim Market Size, Share, Global Industry Analysis and Forecast to 2022-2027
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Silicon wafer reclaim is a processed, cleaned and polished wafer that can be reused for different applications. It involves various steps such as sorting, stripping, polishing, lapping, grinding, cleaning, and inspection that converts a used wafer into a high-quality wafer. It is thinner in size, provides enhanced performance and is more cost-effective as compared to conventional wafers. As a result, these wafers are used to produce microchips, microelectromechanical systems (MEMS), optoelectronic devices, solar and photoelectric cells, and integrated circuits.
Silicon Wafer Reclaim Market Trends and Drivers:
The market is primarily driven by the escalating demand for consumer electronics such as smartphones, laptops, and desktops. In addition, various technological advancements, such as the development of advanced processing solutions that eliminate the risk of defect formation in silicon wafers, represent another major growth-inducing factor.
Besides this, various manufacturers are utilizing large-sized silicon wafers as it enables the fabrication of multiple chips on a single wafer. This, coupled with various initiatives undertaken by governments of numerous countries to promote the installation of solar panels, is positively influencing the market growth.
Furthermore, the increasing mergers and acquisitions (M&A) amongst key players to launch simplified reclaiming procedures and overcome production process complexities are expected to propel market growth in the coming years.
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Global Silicon Wafer Reclaim Market 2022-2027 Analysis and Segmentation:
Competitive Landscape:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
DSK Technologies Pte Ltd., NanoSILICON Inc., Nippon Chemi-Con Corporation, NOVA Electronic Materials LLC, Optim Wafer Services, Phoenix Silicon International Corporation, Pure Wafer, RS Technologies Co. Ltd., Shinryo Corporation (Mitsubishi Chemical Corporation), Silicon Materials Inc., Silicon Specialists LLC and Silicon Valley Microelectronics Inc.
The report has segmented the market on the basis of region, diameter type, application and industry vertical.
Breakup by Diameter Type:
• 150 mm
• 200 mm
• 300 mm
• Others
Breakup by Application:
• Solar Cells
• Integrated Circuits
• Others
Breakup by Industry Vertical:
• Electronics
• Automotive
• Aerospace and Defense
• Mining and Construction
• Others
Breakup by Region:
• North America: (United States, Canada)
• Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
• Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
• Latin America: (Brazil, Mexico, Others)
• Middle East and Africa
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Key highlights of the report:
• Market Performance (2016-2021)
• Market Outlook (2022- 2027)
• Porter's Five Forces Analysis
• Market Drivers and Success Factors
• SWOT Analysis
• Value Chain
• Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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