Hermetic Packaging Market Size, Strategies and Opportunities Forecast 2022-28

According to Precision Business Insights (PBI), the latest report, the market value of the hermetic packaging market is expected to be valued at USD 3,856.2 million in 2022 which is expected to grow at a CAGR of 4.6% over 2022-2028. The primary factors that drive the market are increasing usage in defense aerospace, commercial applications, and military applications, inexpensive and low cost of fuel which has tempted travellers all across the globe resulting in increased frequency of flying.

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Glass-Metal Sealing to Dominate the Hermetic Packaging Market:
Based on material type, glass-metal sealing holds the highest market share. The major factor for the rise of this segment is because of its electrical integrity and reliability. The glass-metal sealing can protect insulators and preserves surface resistance which further provides longer sealing in severe conditions such as high pressure and corrosive chemicals. it has high dielectric properties which can resist temperatures from -65 to + 250 degrees Celsius which can drive the growth of the global hermetic packaging market size. Apart from this, increase demand for hermetic packaging in various industries such as military, sensor packaging, high vacuum, medical, and automotive can also drive the growth of the market.

Asia Pacific Hermetic Packaging Market:
Asia Pacific region is expected to grow significantly in the global hermetic packaging market over the forecast period. The Asia Pacific region is expanding as a result of the evolving economy, an increase in the defense budget, and a rising need for energy. Apart from this, the increase in the military abilities to developing countries such as China, India, and South Korea for sensitive electronic circuits has the potential growth of the C-reactive protein testing market in these regions. High GDP growth rates in these regions have increased the demand for energy which has drive the market growth.

Strategic New Product Launches, Mergers, Acquisitions, and Agreements are the key strategies adopted by market players:
The global Hermetic Packaging market further reveals that the key players are implementing strategies such as the extension of product collection through research and development activities, product launches, acquisitions, mergers, and strategic alliances to improve their market position and strengthen the market revenue share. In January 2022, SCHOTT developed an advanced hermetic packaging solution for RGB laser chips and MEMS mirrors for augmented reality. In September 2021, Hermetic Solutions Group acquired FilConn for expansion of its business.

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The hermetic packaging market is segmented based on, configuration, material type, application, end users, and region.
Based on the configuration, the market is segmented into the following:
• Multilayer Ceramic Packages
• Pressed Ceramic Packages
• Metal Can Packages

Based on the material type, the market is segmented into the following:
• Passivation Glass
• Reed Glass
• Transponder Glass
• Glass-Metal Sealing (GTMS)
• Ceramic-Metal Sealing (CERTM)

Based on the application type, the market is segmented into the following:
• Transistors
• Sensors
• Lasers
• Airbag Ignitors
• Photo Diodes
• Oscillating Crystals
• MEMS Switch
• Others

Based on the end users, the market is segmented into the following:
• Military & Defense
• Aeronautics & Space
• Automotive
• Energy & Nuclear Safety
• Medical
• Telecommunication
• Consumer Electronics
• Others

Based on the region, the market is segmented into the following:
• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

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Key players' profiles in the hermetic packaging market report are Schott AG, Ametek, Inc., NGK Spark Plug Co., Ltd., Teledyne Microelectronic Technologies, Kyocera Corporation, Egide S.A., Legacy Technologies, Inc., Willow Technologies, SST International, Special Hermetic Products, Inc., Sinclair Manufacturing Company, and Mackin Technologies.

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