Non-UV Dicing Tapes Market Analysis, Business Development, Size, Share, Trends, Future Growth, Forecast To 2030

Non-UV Dicing Tapes Market is presently valued at USD 1.59 billion and is poised to reach a valuation of USD 2.13 billion by 2030, registering a CAGR of 6% over the forecast period of 2022-2030.

Non-UV dicing tapes are referred to as the type of adhesive tapes predominantly used to seal large die sizes in the electronics sector. These tapes protect the semiconductor surfaces from wafer since they are equipped with the ability to offer high adhesion even when a surface is exposed to UV light. These dicing tapes are expandable since they are made of non-halogen PET, PO, and PVC.

What are the primary growth determinants and restraints to the industry vertical?

The ability of these tapes to assist the production of energy efficient electronic devices at an affordable cost is primarily augmenting the outlook of this business vertical. Alongside, the booming consumer electronics energy is adding momentum to the market expansion.

Furthermore, the increasing trends of electronic component miniaturization, to decrease the weight of electronic devices for ease of transportation and portability is creating lucrative opportunities for the industry to prosper.

Also, integration of advanced technologies in the field, rapid industrialization, and growing disposable income levels of the masses are positively swaying the dynamics of this business sphere. Besides, rising internet penetration across the globe is escalating the demand for smart devices and wearable. This in turn is fuelling the expansion of global non-UV dicing tapes market.
Moreover, the growing focus of manufacturers to develop advanced products in the field is stimulating the outlook of the industry vertical.

Alongside, increasing cognizance regarding the benefits of non-UV dicing tapes among the end-users is contributing to the market growth.
On the contrary, the volatility in raw material prices and lack of favorable government incentives in various nations are limiting the remuneration scope of this industry vertical.

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Segmental analysis of the market:

Based on Material Type
• PVC
• PET
• PO
• Others
The PO segment is slated to amass notable gains by 2030 owing to their high durability along with pressure and temperature resistance.

By thickness
• 85-125 Micron
• 126-150 Micron
• Below 85 Micron
• Above 150 Micron.

In terms product
• UV curable dicing type
• Non-UV curable dicing type
The UV curable dicing type segment is expected to generate significant returns over the assessment timeframe as it offers high security to wafers while dicing.

On the basis of Application
• Wafer dicing
• Package dicing
• Others
The wafer dicing segment is likely to showcase lucrative growth trends over the forecast period ascribing to the increasing demand for durable consumer electronics.

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Expounding the geographical ambit of this business sphere:

North America, Middle East & Africa, Europe, Asia Pacific, and Latin America are the major benefactors to the expansion of this market vertical. Among these, Asia Pacific is projected to capture a substantial revenue share over 2022-2030. This is attributable to the booming consumer electronics industry, availability of raw materials and low cost labor force, technological advancements in the field, along with widespread industrialization.

Insights to the competitive hierarchy of the market:

The prominent players defining the competitive terrain of the global non-UV dicing tapes market are Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems, Inc., Pantech Tape Co. Ltd., QES GROUP BERHAD, Nippon Pulse Motor Taiwan, Loadpoint Limited., Daest Coating India Pvt. Ltd., Shenzhen Xinst Technology Co. Ltd., and Solar Plus Company.

The aforementioned companies are continuously focusing onto amplifying their reach in the global market by formulating efficient strategies including mergers & acquisitions, new product launches, R&D investments, collaboration deals, and partnerships.

FAQs:

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