Semiconductor Packaging Market Size, Competitive Landscape, Business Opportunities and Forecast 2022-2027

According to IMARC Group latest report titled" Semiconductor Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027", offers a comprehensive analysis of the industry, which comprises insights on semiconductor packaging market. The report also includes competitor and regional analysis, and contemporary advancements in the global market. The market reached a value of US$ 29.7 Billion in 2021. Looking forward, IMARC Group expects the global semiconductor packaging market to reach US$ 47.92 Billion by 2027, exhibiting at a CAGR of 7.70% during 2022-2027.

Semiconductor packaging refers to the containers that protect the integrated circuit chips from surrounding environments. Some commonly available semiconductor packaging variants include embedded die, flip chip, fan-in wafer-level, fan-out wafer-level, etc. They are manufactured with the help of plastic, glass, metallic materials, etc. Semiconductor packaging is widely used to offer support to the enclosed components and prevent physical damage and corrosion to logic units, silicon wafers, memory devices, etc. It also assists in protecting the electronic system from radiofrequency noise emissions, cooling, electrostatic discharge, mechanical damage, etc. Consequently, semiconductor packaging finds several applications across various industries, such as automotive, healthcare, telecommunication, aerospace, etc.

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As the novel coronavirus (COVID-19) crisis takes over the world, we are continuously tracking the changes in the markets, as well as the purchase behaviours of the consumers globally and our estimates about the latest market trends and forecasts are being done after considering the impact of this pandemic.

Market Trends:

The growing product usage in the consumer electronics sector is one of the primary factors driving the semiconductor packaging market. Moreover, the integration of artificial intelligence (AI) and Internet of Things (IoT) technologies with industrial devices to cater to their high power requirements is further bolstering the market growth. In addition to this, the increasing environmental consciousness among the masses and the inflating need for minimizing electronic wastes are acting as significant growth-inducing factors. Furthermore, the escalating demand for semiconductor packaging for numerous medical devices, including ultrasound devices, mobile X-ray systems, patient monitors, etc., is also positively influencing the global market. Apart from this, the expanding product adoption in the aerospace industry to enhance the thermal performance of the aircraft components is anticipated to augment the semiconductor packaging market over the forecasted period.

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Competitive Landscape with Key players:

The report has also analysed the competitive landscape of the market with some of the key players being.
• Amkor Technology Inc.
• ASE Group
• ChipMOS Technologies Inc.
• Fujitsu Limited
• Intel Corporation
• International Business Machines Corporation
• JCET Group Co. Ltd.
• Powertech Technology Inc.
• Qualcomm Incorporated
• Samsung Electronics Co. Ltd.
• STMicroelectronics
• Taiwan Semiconductor Manufacturing Company Limited
• Texas Instruments Incorporated

Semiconductor Packaging Market Segmentation:
Our report has categorized the market based on region, type, packaging material, technology and end user.

Breakup by Type:
• Flip Chip
• Embedded DIE
• Fan-in WLP
• Fan-out WLP

Breakup by Packaging Material:
• Organic Substrate
• Bonding Wire
• Leadframe
• Ceramic Package
• Die Attach Material
• Others

Breakup by Technology:
• Grid Array
• Small Outline Package
• Flat no-leads Package
• Dual In-Line Package
• Others

Breakup by End User:
• Consumer Electronics
• Automotive
• Healthcare
• IT and Telecommunication
• Aerospace and Defense
• Others

Breakup by Region:
• North America (United States, Canada)
• Europe (Germany, France, United Kingdom, Italy, Spain, Others)
• Asia Pacific (China, Japan, India, Australia, Indonesia, Korea, Others)
• Latin America (Brazil, Mexico, Others)
• Middle East and Africa (United Arab Emirates, Saudi Arabia, Qatar, Iraq, Other)

Key highlights of the report:
• Market Performance (2016-2021)
• Market Outlook (2022-2027)
• Porter's Five Forces Analysis
• Market Drivers and Success Factors
• SWOT Analysis
• Value Chain
• Comprehensive Mapping of the Competitive Landscape

We are updating our reports, If you want latest primary and secondary data (2022-2027) with Cost Module, Business Strategy, Competitive landscape, etc. Click request free sample report, the report will be delivered to you in PDF format via email within 24 to 48 hours after the payment confirmation.

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