Die Bonder Equipment Market Forecast To Grow At A CAGR Of 4% To Be Valued At US$ 6.0 Billion From 2022 To 2032

Global Die Bonder Equipment demand is expected to be valued at US$ 4.2 billion in 2022, rising at a CAGR of 4% to US$ 6.0 billion from 2022 to 2032. Increased adoption of stacked die technology in Internet of Things (IoT) devices is driving growth.

As a result, die bonder equipment is widely used in semiconductor device fabrication. Furthermore, various methods for attaching the die to the substrate are used, including epoxy, eutectic, soft solder, and flip chip.

This, in turn, is expected to create lucrative growth opportunities for die bonder equipment manufacturers in the coming years, resulting in a significant CAGR for the die bonder equipment market during the forecast period.

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Global Die Bonder Equipment Market: Dynamics

Growing demand for semiconductor integrated circuits is one of the key factors expected to drive the overall demand for die bonder equipment in future. Increasing adoption of electronic systems due to rising number of end-use applications will create healthy demand for integrated circuits (ICs). This, in turn, is propelling the demand for die bonder equipment in the global market. Additionally, growing adoption of IOTs, ultra high definition television and hybrid laptops is further expected to create significant demand for die bonder equipment in future. Furthermore, growing demand for polymer adhesive water bonding equipment is further expected to become a barrier to the growth of the die bonder equipment market in future.

Global Die Bonder Equipment Market: Regional Outlook

In the global market of die bounder equipment, Asia Pacific is expected to dominate the market owing to growing demand from the region. This growing demand can primarily be attributed to the presence of a huge number of IC manufacturers in the region. Growing IC demand due to increasing smartphones and tablets production will make the region grow at a healthy pace in future.

Moreover, the market for die bonder equipment in North America and Europe is also projected to grow at a healthy pace owing to increasing demand for semiconductors ICs from the region. The fast adoption of new and latest technologies in the region is also expected to drive the market in the region. Furthermore, MEA and Latin America are also expected to create demand for die bonder equipment in future as the market in these regions is in the growing stage as compared to other regions.

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Global Die Bonder Equipment Market: Market Participants

In the global die bonder equipment market, manufacturers are continuously focused towards automation of the tie bonding technology. Names of some of the manufacturers engaged in the development and manufacturing of die bonder equipment are mentioned:

• Besi
• ASM Pacific Technology Limited (ASMPT)
• Kulicke & Soffa Industries, Inc.
• Tresky AG
• SHIBAURA MECHATRONICS CORPORATION
• West·Bond, Inc.
• Panasonic Corporation
• MRSI Systems
• SHINKAWA LTD.
• Palomar Technologies
• DIAS Automation
• Toray Engineering
• FASFORD TECHNOLOGY

The research report presents a comprehensive assessment of the Die Bonder Equipment market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated Die Bonder Equipment market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to Die Bonder Equipment market segments such as geographies, application, and industry.

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Future Market Insights (ESOMAR certified market research organization and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments on the basis of Source, Application, Sales Channel and End Use over the next 10-years.

This release was published on openPR.