Press release
Substrate-Like PCB Market is anticipated to Record a CAGR of 17.8% to Reach a Valuation of US$ 4,718.6 million by Forecast 2021-2028
Substrate-Like PCB Market
Substrate-like PCB (SLP PCB) is the next generation of high-density PCB, which requires trace/spacing equal to or less than 30/30 μm (40/40 μm is the current limit for HDI) for further reducing the device size, leaving more space for other components. The rising adoption of SLP by smartphone companies due to the transition from 4G to 5G technology provides a massive opportunity for the growth of the substrate-like PCB market players.
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Competitive Landscape: Substrate-Like PCB Market: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft; Compeq Co., Ltd.; DAEDUCK ELECTRONICS Co., Ltd.; IBIDEN; KINSUS INTERCONNECT TECHNOLOGY CORP; Korea Circuit; SAMSUNG ELECTRO-MECHANICS; TTM Technologies Inc.; Unimicron; and Zhen Ding Tech.
The expansion in 5G infrastructure is expected to increase the demand for PCBs and substrates for mainboards and modules in various end-user industries, including consumer electronics, automotive, medical, industrial, and telecommunications. Smartphones have evolved from 4G LTE to 5G support, and the complexity of Massive MIMO antenna configurations has made RF front-ends take up more space in 5G smartphones. In addition, the amount of data processed by the 5G system is expected to grow geometrically in the near future, thereby increasing the requirement for high battery capacity. Thus, PCBs and other electronic components must be compressed to achieve higher density and smaller form factor, which is pushing substrate-like PCBs toward thinner, smaller, and more complex processes.
As the demand and sales of portable electronics continue to surge in different markets, electronic modules or devices must prioritize size and weight reductions in many of today's application areas and simultaneously provide reliable signal integrity for high-speed transmissions, even in harsh environments. Miniaturized components need to be arranged within a limited dimension, which is not feasible in conventional printed circuit boards (PCBs). This limitation is driving the need for substrate-like PCBs as it is a cross between a rigid board and a flexible substrate. These PCBs have particularly been introduced to address the elevating need for miniaturization in various electronic products with enhanced features.
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The substrate-like PCB market has been segmented on the basis of line/space, inspection technologies, and application. Based on line/space, the market is further segmented as 25/25 and 30/30 µm, and less than 25/25 µm. Based on inspection technology, the substrate-like PCB market is segmented as automated optical inspection, direct imaging, and automated optical shaping. Based on application, the substrate-like PCB market is subsegmented into consumer electronics, automotive, medical, industrial, and others.
Additionally, rising trends in technologies such as IoT, 5G, and smart cars are further catalyzing the miniaturization of PCBs; they are also making substrates more powerful. To support these technological trends, the use of substrate-like PCB has increased. Smartphone manufacturers are miniaturizing the devices to make them portable and easier to handle. For instance, in May 2018, AT&S showcased various products at the 14th AT&S Technology Forum. One of them was mSAP (stands for the modified semi-additive process) technology through which the company can achieve highly miniaturized and precise PCB structures.
Impact of COVID-19 Pandemic on Substrate-Like PCB Market
North America is one of the most important regions for the adoption and growth of new technologies due to favorable government policies to boost innovation, the presence of a huge industrial base, and high purchasing power especially in developed countries such as the US and Canada. Hence, any impact on the growth of industries hampers the economic growth of the region. The US has a prominent substrate-like PCB market size due to the growing automotive and consumer electronics industry and rising focus on the expansion of 5G networks.
Chapter Details of Substrate-Like PCB Market:
Part 01: Executive Summary
Part 02: Scope of The Report
Part 03: Substrate-Like PCB Market Landscape
Part 04: Substrate-Like PCB Market Sizing
Part 05: Substrate-Like PCB Market Segmentation by Product
Part 06: Five Forces Analysis
Part 07: Customer Landscape
Part 08: Geographic Landscape
Part 09: Decision Framework
Part 10: Drivers and Challenges
Part 11: Market Trends
Part 12: Vendor Landscape
Part 13: Vendor Analysis
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Contact Person: Sameer Joshi
E-mail: sales@theinsightpartners.com
Phone: +1-646-491-9876
About Us:
The Insight Partners is a one-stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We specialize in industries such as Semiconductor and Electronics, Aerospace and Defense, Automotive and Transportation, Healthcare, Manufacturing and Construction, Media and Technology, Chemicals, and Materials.
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