Wafer-level Test and Burn-in [WLTBI] Market Is Expanding At A CAGR Of 4% During The Forecast Period

Wafer-level test and burn-in (WLTBI) introduces the means of subjecting semiconductor devices to electrical testing and burn-in while in wafer form. Burn-in is a stress test for temperature reliability used for detection and screening of potential errors in the early phase. The process works by employing a wafer prober to provide the necessary electrical excitation to all the blocks on the die of the wafer through numerous ultrathin probing needles that land on contact pads, ball grid arrays, or bumps on the die. On the contrary, the desired temperature of the die is obtained by the wafer prober through a built-in hot plate that elevates the temperature of the wafer to the required junction temperature.

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The applications of WLTBI are important in several industries, especially in integrated device manufacturers and outsourced assembly and test companies. Moreover, the WLTBI applies to machines sold as a bare die, wafer-level packaged tools, and devices that are designed for conventional packaging. Moreover, the use of semiconductors in electronic systems and parts of automobiles such as infotainment, engine control, and safety features has been increased and is further expected to grow in demand. The current increased demand for semiconductors and the growing application of WLTBI are likely to boost the global wafer-level test and burn-in (WLTBI) market during the forecast period.

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Slowdown in Semiconductor Industry Impacts WLTBI Market During COVID-19 Crisis

The COVID-19 pandemic has impacted various fundamental sectors that include customer behavior, business revenues, and numerous aspects of corporate operations. Many organizations are struggling with unclear future decisions, some of whom may face severe losses in the crisis. However, businesses are in a dire need of government interventions and other variables depending on the industry type and tax leverages. There is a massive impact on the wafer-level test and burn-in (WLTBI) market due to the heavy effects of COVID-19 on semiconductors, automobiles, and the consumer electronics industry.

Semiconductor companies that are major consumers of the WLTBI have made a strategic decision in favor of protecting employees, securing supply chains, and addressing other pressing concerns. This has resulted in a halt on production activities. In addition, various governments continue to impose physical-distancing requirements and limited production activities to help fight the spread of harmful coronavirus. This expects to hinder the ongoing growth rate till the pandemic is over. However, key leading companies are preparing for the opportunities for when the pandemic abates and the next normal begins. The pandemic situation is expected to improve shortly, opening markets and production, and the wafer-level test and burn-in (WLTBI) market is anticipated to grow during the projected period.

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WFTBI in High Demand for Electronic Systems, Automobiles Parts

The semiconductor industry is necessary for all the sectors to provide products with increased functionality at a low cost. The increasing demand for known good die (KGD), including a variety of Systems in a Package, Multi-Chip Modules, and stacked memories, highlights the significance of cost-effective and viable WLTBI solutions. The wafer-level burn-in technology needs a single alignment step and a single dimensionally stable fixture to burn numbers of ICs concurrently. This approach can be cost-effective as compared to numerous precision die carriers. Moreover, semiconductor devices can be tested on exposed wafers without the necessity to cut the wafer into devices and package them. Ultrathin probing needles are used to communicate with contact pads on the die and to supply the required electrical excitation to the die under test. All these factors are contributing to the expansion of the wafer-level test and burn-in (WLTBI) market.

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