3D IC and 2.5D IC Market: Business Growth Analysis & Key Market Driver By 2027

Among any other electronic circuit, 3D IC and 2.5D IC have the best electronic architecture. Among millennial these compact, handy yet advanced electronic devices are becoming very popular.

The key components among the electronic devices are IC packages. Thus, growing demand and sales are directly responsible for the 3D IC and 2.5D IC market growth.

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Furthermore, as technologies, such as artificial intelligence, 5G, high-performance computer, are continuing to evolve in our world, the demand for these semiconductors are also escalating.

These devices are used to enhance performance, lower the latency, and increase the bandwidth and power efficiency of electronic devices.

Moreover, factors, such as the growing use of advanced architecture in electronic products, the rising trend of miniaturization of electronic devices, and the growing market for tablets, smartphones, and gaming devices, are some of the other drivers of this market.

However, current unit cost, low volumes, and implementation risks of ICs restraint the growth of the 3D IC and 2.5D IC market.

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Furthermore, in the manufacturing of these silicon wafers, thermal energy is required. Sometimes, the difference in coefficient of thermal expansion manufacturing defects and malfunctions can occur.

Furthermore, the demand for silicon wafers is increasing; hence, companies are trying to push their boundaries by innovating technologies such as 3D IC and 2.5D IC. The demand for new and better technology is growing day by day.

Thus, companies are more focused on product development and are investing money for their R&D, which is opportunistic for the market. Well-established companies in the 3D IC and 2.5D IC market are trying to come up with better and advanced versions of these devices.

For instance, ASE is introducing high-density Fan Out technology for die stacking & multi-die solutions to achieve high bandwidth & high performance across the market landscape, addressing a demand from high-density data centers to consumer & mobile space.

Furthermore, as the number of competitors increases in the market, innovation of advanced products also increases. To ensure operational efficiency with added convenience and increased productivity, global companies have started introducing 3D IC and 2.5D IC in different programmable logic.

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For instance, Intel Corp. is leading the market in-field programming gate arrays. Moreover, the growing consumer electronics sector, particularly for smartphones and tablets has a high demand for 3D IC and 2.5D IC packaging technology. Computing workload has evolved a lot in the past few decades.

Packaging technology, which was just a backend process and inconvenience is now brought to the forefront for innovation and they are critical to product performance function and cost.

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