Press release
North America Redistribution Layer Material Market Latest Innovations, Drivers and Industry Key Events 2021-2028 | Amkor Technology, ASE Group, Fujifilm Corporation
The redistribution layer material market in North America is expected to grow from US$ 17.19 million in 2021 to US$ 34.06 million by 2028; it is estimated to grow at a CAGR of 10.3% from 2021 to 2028.The consumer electronics industry is evolving at an exponential pace. The pressure of demands from the consumer side has been compelling suppliers to provide distinguished products and be the first movers in the market. Tough competition with peers in the consumer electronics industry has resulted in price wars leading to decreasing profitability for the manufacturers. As a result of these factors, manufacturers strive continuously for innovations in their product offerings. Often manufacturers have been curious about becoming the pioneers of new products in the market.
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The analog-to-digital conversion brought about many new standards in audio and video, which improved the quality and affordability of the digital multimedia experience. Further, with the rise of broadband, accessing media has become easy and rewarding for consumers. The proliferation of smart products is driving the need for engineers to improve electronic product design and focus on delivering lower cost, lower power, and higher performance through the integration of discrete functions.
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Major Key players covered in this report:
• Amkor Technology
• ASE Group
• Fujifilm Corporation
• Hitachi Chemical DuPont MicroSystems L.L.C.
• INFINEON TECHNOLOGIES AG
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• NXP Semiconductors
• Samsung Electronics Co., Ltd.
• Shin-Etsu Chemical Co., Ltd.
• SK Hynix Inc.
NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET SEGMENTATION
North America Redistribution Layer Material Market, by Material Type
• Polyimide (PI)
• Polybenzoxazole (PBO)
• Benzocylobutene (BCB)
• Others
North America Redistribution Layer Material Market, by Application
• Fan-Out Wafer Level Packaging (FOWLP)
• 2.5D/3D IC Packaging
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COVID-19 pandemic created an adverse impact on the economic growth of North America. The US is the world's worst affected country due to the COVID-19 outbreak. As a result, there is a decline in the procurement of new devices due to temporary shutdown of businesses and disruptions in supply chain and manufacturing activities. All these factors have impacted the revenue and growth of the North America redistribution layer material market. Small and medium-size companies/startups in the market witnessed a severe impact of the pandemic. However, ongoing restructuring efforts taken by semicustom companies to tackle the supply chain issues and increase coordination with sales partners and suppliers can help in reducing the negative impact of the pandemic.
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