Press release
System in Package (SIP) Market Emerging Trend, Top Companies, Industry Demand and Regional Analysis
System in Package (SIP) Market
SiP technology is a packaging technique that mixes multiple electronic sub components with various passive components on a single substrate. The main advantages of SiP technology are that they are not just IC packages with multiple dies, but they also include active systems or subsystems within the IC package.
The packaging technology, packaging method, end user, and geographical segments of the system in package (SiP) technology market. The market is divided into three categories based on packaging technology: 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. It is divided into wire bond and flip chip categories based on the packaging technology. Consumer electronics, automotive, telecommunications, industrial systems, aerospace & defence, and others are the end user segments of the market. The research also includes a comprehensive System in Package (SiP) Technology Market Analysis based on competitive intensity and how the competition will evolve in the coming years.
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A system in package (SIP) is a technique that combines many integrated circuits (ICs) or semiconductor dies with diverse functionality into a single package or a system that performs multiple functions. Optical components, MEMS, and other packages or devices are included. Sip has progressed from a niche technology with a limited number of applications to a high-volume technology with a wide range of uses. In mobile applications, the technology is often employed in stack memory or logic devices, as well as compact modules. The market for system-in-package dies has grown tremendously because to the two aforementioned uses. SiP has become a viable alternative to System on Chip (SoC) due to various advantages such as flexibility, inexpensive R&D costs, low product costs, and reduced NRE.
Global System in Package (SIP) Market- Segment Analysis
Key Players
Access
Analog Devices
Apple
ARM
ASE Group
Avago
AT&S
Bosch
Broadcom
Carsem
China WLCSP
Chipbond
ChipMOS
Cisco
Cyntec
Cypress
Semiconductor
Deca Technologies
Dyconex
Fitbit
Flexceed
Flip Chip International
Formosa
Fraunhofer IZM
Freescale
Fujikura
Fujitsu
SIP Market based on packaging technology:
• 2-D IC packaging
• 2.5-D IC packaging
• 3-D IC packaging
SIP Market based on Package Type:
• Ball Grid Array (BGA)
• Surface Mount Package (SOP)
• Pin Grid Array (PGA)
• Others
SIP Market based on Packaging Methods
• Wire Bond
• Flip Chip
SIP Market based on device
• RF Front- End
• RF Amplifier
SIP Market based on Application:
• Consumer Electronics
o Wearables
o Cameras
o Mobile Handsets
o Others
• Telecom, Communications and Infrastructure
• Industrial
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Report scope
System in Package (SIP) Market- Historical Years- 2018-2021
System in Package (SIP) Market- Forecast years- 2022-2030
System in Package (SIP) Market 2020- USD 145,884.3 million
System in Package (SIP) Projected Market 2030- USD 767,718.9 million
System in Package (SIP) Market CAGR- 17.9%
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