Thermal Management Material Market Trends, Market Share, Industry Size, Growth, Opportunities and Market Forecast - 2022 to 2028

The thermal management material market is anticipated to grow at a significant CAGR during the forecast period (2022- 2028).Increasing demand for thermal management solutions and systems in different industries such as healthcare, automotive, and aerospace & defense is leading to the market growth across the globe. The growing use of large and small size, high power devices in the healthcare sector for treatment and analysis applications is leading to increased demand for thermal management solutions and systems, thereby leading to the growth of the market. Cool Chips are active cooling technology wherein chips acts as a cooling agent for electronic system installed in computers and automobiles. For instance, in the interchip cooling method, chips are employed to overcome heat dissipation issues in electronic devices. This method is used to design embedded systems using microfluids.

A full report of Thermal Management Material Market is available at:https://orionmarketreports.com/thermal-management-material-market/98286/  

Some major players in the market include 3M Co., Honeywell International Inc., and DuPont de Nemours, Inc., among others. The market players are contributing significantly to the growth of the market by the adoption of various strategies including mergers & acquisitions, geographical expansion, partnerships and collaborations, and new product launches, to stay competitive in the market. For instance, in April 2019, Henkel has developed two new, one-part, cure-in-place thermal management materials to address the requirements for simplified processing and eliminate the concerns around dispensing speed with pre-cured, one-part gels.  The first, a Bergquist Liqui Form material, has a thermal conductivity of 3.5 W/m-K and, once dispensed, cures at room temperature. This material is ideal for applications that require fast and easy processing, low assembly stress and a robust final cured modulus for lifetime gap stability. With a thermal conductivity of 4.5 W/m-K, the second one-part TIM is a silicone-free Bergquist Gap Filler moisture-cure material designed for applications where silicone is a concern (for instance, optical systems in ADAS, industrial automation drives, and PLCs) and high-temperature stability of up to 150°C is required.

Market Coverage

The market number available for - 2021-2028
Base year- 2021
Forecast period- 2022-2028
Segment Covered-
By Product Type
By Application
Regions Covered-
North America
Europe
Asia-Pacific
Rest of the World
Competitive Landscape-3M Co., Honeywell International Inc., and DuPont de Nemours, Inc., among others.

Key questions addressed by the report

What is the market growth rate?
Which segment and region dominate the market in the base year?
Which segment and region will project the fastest growth in the market?
How has COVID-19 impacted the market?
Deviation from the pre-COVID-19 forecast
Most affected region and segment
Who is the leader in the market?
How players are addressing challenges to sustain growth?
Where is the investment opportunity?

Global Thermal Management Material Market Report by Segment

By Product Type

Adhesive Materials
Tapes
Films
Adhesive Liquids
Non-Adhesive Materials
Thermal Pads
Gap Fillers
Others

By Application

Consumers Electronics
Automotive
Telecommunication
Aerospace and Defense
Others

 

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This release was published on openPR.