Press release
System in Package Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2030
System in Package Market
According to the research report published by Credible Markets, global system in package (SIP) market is currently valued at USD 12 billion and is anticipated to register a CAGR of 10% over the forecast period of 2022-2030.
Global System in Package (SIP) Market- Overview
System in Package or Multi-Chip Modules are multiple integrated circuits that are enclosed in one or more chip carrier packages. SIPs perform almost all the crucial functions of an electronic system and are used inside devices such as smart phones, digital music players, tablets, among others. These systems offer numerous benefits including high flexibility, low research & development cost, lesser NRE expenditure, and low product cost.
Key market trends- Growth determinants and restraints
The primary factors augmenting global system in package (SIP) market outlook are increasing adoption of smart phones and other devices along with growing demand for the miniaturization of electronic devices. Alongside, the deployment of 5G technology is boosting the requirement for SIP based RF components as they are equipped with the ability to ensure high data rate and improved signal quality.
Furthermore, expansion in the portable electronics market, surging popularity of IOT, and widespread adoption of graphic cards and processors in gaming technology are positively swaying the market dynamics.
On the contrary, high cost of SIP and rising concerns regarding the sudden increase in integration level which in result in thermal issues are likely to impede market progression in the ensuing years.
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Segmental Analysis of global system in package (SIP) market
Based on package method-
• wire bond and die attach
• flip chip
• fan-out wafer level
The fan-out wafer level segment is poised to generate significant revenues over the analysis timeline ascribing to rising demand for a large quantity of I/O points for semiconductor devices.
Based on device-
• RF amplifier
• RF front end.
The RF front end segment is anticipated to register notable gains over the forecast period owing to escalating demand for high frequency and compact transceivers in smart devices.
Based on application-
• automotive & transportation
• aerospace & defense
• healthcare
• consumer electronics
• industrial
• others
Based on packaging technology -
• 2D IC
• 2.5D IC
• 3D IC
Based on packaging type-
• ball grid array
• pin grid array
• flat package
• small outline package
• surface mount package
Asia Pacific is expected to capture the highest market share
Asia Pacific, North America, Europe, and Middle East & Africa are the primary regions considered to understand the geographical dynamics of the industry. Asia Pacific is anticipated to dominate the overall market in terms of market share attributing to growing demand for SiP from consumer electronics sector coupled with the presence of prominent companies in this sector including Samsung Electronics and Sony.
Competitive landscape
The major companies constituting the competitive hierarchy of global system in package (SIP) industry are Amkor Technology Inc, Powertech Technologies Inc, Toshiba Corporation, Fujitsu Ltd, Chipmos Technologies Inc, Renesas Electronics Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd, Samsung Electronics Co., Ltd, and ASE Group.
Click here to Direct Purchase of System in Package Market Research Report: https://crediblemarkets.com/reports/purchase/system-in-package-market-202961?utf8=%E2%9C%93&license_type=single_user
Major developments
• Amkor Technology in May 2016 inked a collaboration deal with Cadence aiming at the development of packaging assembly design kits for SWIFT technologies and silicon-less integrated modules. This in turn would enable consumers to decrease the SLIM and SWIFT verification cycles.
Major Questions answered in this report
• What are the growth rate projections for system in package market over 2022-2030?
• What are the primary growth propellants of system in package market?
• Which are the key regions constituting the geographical landscape of system in package market?
• Which are the top players operating in system in package market?
Key takeaways from the report-
• The system in package market is poised to amplify at a CAGR of 10% over 2022-2030
• Growing adoption of smart devices and emergence of 5G technology are the major growth propellants
• RF front end device segment is likely to generate significant returns
• Asia pacific is set to capture a high market share owing to the presence of prominent consumer electronics manufacturers
Contact Us:
Credible Markets
Phone- +1(929)-450-2887
Email- sales@crediblemarkets.com
Web: https://www.crediblemarkets.com/
About Credible Markets:
Credible Markets in one of the leading market research firms providing a 360-degree outlook of various industry dynamics to their clients. The reports and services offered by Credible Markets are used by prominent industry participants including investors, manufacturers, stakeholders, and new entrants.
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