With reach US$ 4,718.6 Million, Substrate-Like PCB Market shares overview with 17.8% CAGR by 2028 - Exclusive Research by The Insight Partners

Substrate-like PCB (SLP PCB) is the next generation of high-density PCB, which requires trace/spacing equal to or less than 30/30 μm (40/40 μm is the current limit for HDI) for further reducing the device size, leaving more space for other components. The rising adoption of SLP by smartphone companies due to the transition from 4G to 5G technology provides a massive opportunity for the growth of the substrate-like PCB market players. The expansion in 5G infrastructure is expected to increase the demand for PCBs and substrates for mainboards and modules in various end-user industries, including consumer electronics, automotive, medical, industrial, and telecommunications.

According to our latest market study on "Substrate-Like PCB Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Line/Space (25/25 and 30/30 µm, and Less than 25/25 µm), Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping), Application (Consumer Electronics, Automotive, Medical, Industrial, and Others)," the market is projected to reach US$ 4,718.6 million by 2028 from US$ 1,494.9 million in 2021; it is expected to grow at a CAGR of 17.8% from 2021 to 2028.

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As the demand and sales of portable electronics continue to surge in different markets, electronic modules or devices must prioritize size and weight reductions in many of today's application areas and simultaneously provide reliable signal integrity for high-speed transmissions, even in harsh environments. Miniaturized components need to be arranged within a limited dimension, which is not feasible in conventional printed circuit boards (PCBs). This limitation is driving the need for substrate-like PCBs as it is a cross between a rigid board and a flexible substrate. These PCBs have particularly been introduced to address the elevating need for miniaturization in various electronic products with enhanced features.

Additionally, rising trends in technologies such as IoT, 5G, and smart cars are further catalyzing the miniaturization of PCBs; they are also making substrates more powerful. To support these technological trends, the use of substrate-like PCB has increased. Smartphone manufacturers are miniaturizing the devices to make them portable and easier to handle. For instance, in May 2018, AT&S showcased various products at the 14th AT&S Technology Forum. One of them was mSAP (stands for the modified semi-additive process) technology through which the company can achieve highly miniaturized and precise PCB structures.

The increasing demand for consumer electronics, such as smartphones, tablets, smart bands, fitness bands, and wearables, is driving the global substrate-like PCB market. The rising uptake of substrate-like PCB by various smartphone manufacturers, such as Apple and Samsung, and investment for product development by key players are supporting the growth of this market. For instance, in 2020, Apple launched two "iPhone SE 2" models in different sizes. These models use a 10-layer substrate-like PCB (SLP) manufactured by AT&S for their motherboard. Moreover, the use of robotics in the medical field in neurosurgery and bone-cutting operations is projected to create a massive opportunity for the PCB market players to offer products for the healthcare sector.

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Growing Adoption of Substrate-like PCB in Medical and Industrial Equipment Fuels Market Growth

As technologies advance, revealing new capabilities, the healthcare sector has started to use more PCBs. These components play a significant role in devices used for diagnostics, monitoring, treatments, etc. Smart medical devices are expected to give healthcare professionals more real-time data on their patients than ever before and operate with greater precision with the help of more precise sensors that are connected through IoT. Substrate-like PCBs are likely to find significant applications in CT and CAT scanners in the future. Moreover, the use of robotics in the medical field in neurosurgery and bone-cutting operations is projected to create a massive opportunity for the PCB market players to offer products for the healthcare sector.

Substrate-Like PCB Market: Competitive Landscape and Key Developments

The key players operating in the global substrate-like PCB market and profiled in the market study include AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Compeq Co., Ltd.; DAEDUCK ELECTRONICS Co., Ltd.; IBIDEN; KINSUS INTERCONNECT TECHNOLOGY CORP; Korea Circuit; SAMSUNG ELECTRO-MECHANICS; TTM Technologies Inc.; Unimicron; Zhen Ding Tech. Group Technology Holding Limited.

Players operating in the substrate-like PCB market are mainly focused on the development of advanced and efficient products.

• In 2021, Samsung Electro Mechanic Co. Ltd. announced that it would invest a total of US$ 850 million in its Vietnamese production plant by 2023 to build production facilities and infrastructure for semiconductor package substrates. This is expected to enable the company to meet the rising demand for semiconductor substrates in the coming years.

• In 2021, AT&S announced detailed information about its plan to invest in a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah, Malaysia. This development is expected to strengthen the company's position in the Southeast Asian market as a manufacturing hub.

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