Press release
System in Package Technology Market 2022 : Future Growth Prospect, Industry Share And Growing Demand Analysis Till 2026
The System in Package Technology Market report offers an in-depth assessment of market dynamics, the competitive landscape, segments, and regions in order to help readers to become familiar with the System in Package Technology market. It particularly sheds light on market fluctuations, pricing structure, uncertainties, potential risks, and growth prospects to help players to plan effective strategies for gaining successful in the System in Package Technology market. Importantly, it allows players to gain deep insights into the business development and market growth of leading companies operating in the System in Package Technology market.The system in package technology market is expected to register a CAGR of 8% over the forecast period 2021 - 2026.
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Top Leading Companies of System in Package Technology Market are - Amkor Technology Inc., ASE Group, Samsung Electronics Co Ltd., Powertech Technologies Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm, Renesas Electronics Corporation, ChipMOS Technologies Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technologies Inc., Siliconware Precision Industries Co., Freescale Semiconductor Inc. and others.
Industry News and Updates:
- April 2020 - Fujitsu has received a supercomputer order from Japan Aerospace Exploration Agency. Its new computing system will consist of Fujitsu Supercomputer PRIMEHPC FX1000 with 19.4 petaflops (approximately 5.5 times the theoretical computing performance of the current computing system), in addition to 465 nodes of x86 servers Fujitsu Server PRIMERGY series for general-purpose systems handling diverse computing needs. The new system will be used for conventional numerical simulations, AI computational processing platform for joint research/shared use, and large-scale data analysis platform to aggregate/analyze satellite observation data.
- March 2020 - Toshiba Corporation has launched 80V N-channel power MOSFETs fabricated with the latest generation process. The new MOSFETs are suitable for switching power supplies in industrial equipment used in data centers and communication base stations.The expanded line-up includes "TPH2R408QM," housed in SOP Advance, a surface-mount type packaging, and "TPN19008QM," housed in a TSON Advance package.
Key Market Trends:
Automotive Industry Will Witness Significant Growth
- The automotive sector especially electric vehicles will experience growth in the forecast period due to the growing sensitivity of fossil fuel and increasing government measures towards a cleaner environment. For instance, in automotive sectors, giants like General Motors plans to release autonomous (driverless car) cars in 2021 while AUDI collaborated with Nvidia to develop a capability for the non-human supervised car models. The prototype of this highly automated car is based on AUDI’s Q7 car model. SIP technology is used in smart and electric vehicles in its electric components such as power modules (ADI Modules), sensors (MEMS), transmission control unit, vehicle central infotainment unit, single-chip module, etc.
North America is Expected to Witness Significant Growth
- North America is expected to grow the demand for system in package technology due to increase implementation of connected devices, rapid investment for expansion of 5G, and adoption of robots across all the sectors to automate the various workflow for better efficiency.
- RF power amplifier and baseband processor are used for optical communications, satellite communications, high-speed pulse experiments, data transmission, radar, and antenna measurement. Rapid penetration of 5G in North America is growing the demand for SIP technology. For instance, Ericsson’s 2019 report on the mobile industry has predicted that by 2024 there may be 1.9 billion 5G cellular subscriptions that may drive the growth of IoT devices. The North American market is expected to grow most with 63% of mobile subscriptions with 5G service, and 47% of cellular subscribers in East Asia may have 5G access as well due to reductions in chipset prices and the expansion of cellular technologies, such as NB-IoT and Cat-M1.
Investigator Observers Strong Growth in Specific Regions:
– Europe Market (Germany, UK, France, Russia, Italy)
– Center East and Africa Market (Saudi Arabia, UAE, Egypt, Nigeria, South Africa)
– South America Market (Brazil, Argentina, Colombia)
– North America Market (United States, Canada, Mexico)
– Asia Pacific Market (China, Japan, Korea, India, Southeast Asia).
The Latest Industry Data Included in this Report:
- System in Package Technology Market Size & Analysis (2016 - 2026)
- Market Share Analysis of System in Package Technology Market (%),2016 - 2026
- System in Package Technology Market Share, By Brand
- System in Package Technology Market Share, By Company
- System in Package Technology Market Assessment & Opportunity (Value),2016 - 2026
- Major Companies System in Package Technology Market Value Analysis & Forecast
- Promising System in Package Technology Development by Major Companies
- Detailed System in Package Technology Portfolio of the Major Companies
- Major Deals in the System in Package Technology Market
- Major Companies Analysis
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- Country Level analysis for any 5 countries of your choice.
- Competitive analysis of any 5 key market players.
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MarketInsightsReports provides syndicated market research on industry verticals including Healthcare, Information and Communication Technology (ICT), Technology and Media, Chemicals, Materials, Energy, Heavy Industry, etc. MarketInsightsReports provides global and regional market intelligence coverage, a 360-degree market view which includes statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.
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