3D TSV and 2.5D Market 2022 Precise Outlook- Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Toshiba Corp., Pure Storage Inc., ASE Group

The report considers the present scenario of the 3D TSV and 2.5D Market and its dynamics for the forecast period 2022-2026. 3D TSV and 2.5D Market covers a detailed overview of several growth enablers, restraints, and trends in the market. The research report highlights the market’s current and potential key opportunities along with crucial insights.              

The 3D TSV and 2.5D Market is expected to register a CAGR of 35.3% over the forecast period from 2021 to 2026.

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The 3D TSV and 2.5D market is highly competitive and consists of a number of major players. Companies like Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Toshiba Corp., Pure Storage Inc., ASE Group, Amkor Technology, Inc., United Microelectronics Corp., STMicroelectronics NV, Broadcom Ltd, Intel Corporation, Jiangsu Changing Electronics Technology Co. Ltd Amongst Others.

Key Developments:

- March 2020 - Taiwan-based TSMC collaborated with US-based Broadcom to introduce an enhanced Chip-on-Wafer-on-Substrate (CoWoS) platform, a 2.5D IC TSV interposer-based packaging technology, that supports the industrys first and largest full 2x reticle size interposer. According to the company, the higher memory capacity and bandwidth make it ideal for memory-intensive applications, such as deep learning, 5G networking workloads, and power-efficient data centers. The new technology also offers additional space and increased flexibility and yield for intricate ASIC designs.
- February 2020 - Samsung Electronics announced the market launch of Flashbolt, its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high-performance computing (HPC) systems and help system manufacturers advance their supercomputers, AI-driven data analytics state-of-the-art graphics systems promptly. This HBM2E package is interconnected in an accurate arrangement of more than 40,000 TSV micro bumps, with each 16Gb die containing over 5,600 of these microscopic holes.

Market Segmentation:

Segment by Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Segment by Application
Consumer Electronics
Information and Communication Technology
Automotive
Military
Aerospace and Defense
Other

Key Market Trends:

Consumer Electronics is Expected to Hold Significant Share
- Consumer electronics is one of the most significant segments and is expected to grow at a considerable pace due to the rising number of smartphones, tablets, and other hand-held devices. According to Jefferies and Company, global smartphone shipments are bound to reach 2.45 billion units by the end of 2020. Due to advancements in technology in major sectors, the size of products, such as gaming devices and wireless handsets, encourages manufacturers to produce miniature-sized products, thereby, contributing to the market growth. The evolution of touch screens and other advanced features stacked behind the display, such as in-display fingerprint sensors and pressure sensors, are vital elements to differentiate consumer electronics in the market that attract new buyers.
- Samsung introduced its Galaxy Watch, a smartwatch with a Bluetooth or standalone LTE model. Moreover, Huami Corporation, a biometric and activity data-driven company with significant expertise in smart wearable technology, also launched the Amazfit Verge and the Amazfit smartwatch. According to Consumer Technology Association, smartwatch unit sales reached 141 million (unit sales) in 2018, from 75 million in 2017, which is expected to contribute in 3D TSV demand. The demand for IoT-based consumer electronics may continue to gain traction, especially in Europe. This growth can be attributed to the growing trend of miniaturization and the ongoing need for connectivity.

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What are the market factors that are explained in the report?

–Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a regional scale.

–Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

–Analytical Tools:  3D TSV and 2.5D Market report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, feasibility study, and investment return analysis have been used to analyze the growth of the key players operating in the market.

Finally, 3D TSV and 2.5D Market report is the believable source for gaining the Market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request and Market development rate and figure and so on. This report additionally Present new task SWOT examination, speculation attainability investigation, and venture return investigation.

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