Fan Out Packaging Market 2022 Size, Status and Growth Outlook - Taiwan Semiconductor Manufacturing Company Limited, Jiangsu Changjiang Electronics Tech Co

The Fan Out Packaging Market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

The Fan-out Packaging market is expected to witness a CAGR of 18% during the forecasted period (2021 - 2026).

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Top Leading Companies of Fan Out Packaging Market are Taiwan Semiconductor Manufacturing Company Limited, Jiangsu Changjiang Electronics Tech Co., Amkor Technology Inc., Advanced Semiconductor Engineering Inc, Samsung Electro-Mechanics, Powertech Technology Inc., Exhaustive List of Players in the Industry and others.

Industry News and Updates

Sept 2019 Innolux Corp confirmed on developing fan-out panel-level packaging (FOPLP) for semiconductors along with the Industrial Technology Research Institute.

- Aug 2019 - Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, ammounced that its M-Series fan-out wafer-level packaging (FOWLP) was adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung's flagship S10 handset, along with the Xiaomi Mi 9 and LG G8 handsets.

Key Market Trends

Taiwan to Hold a Significant Share in the Market

- Taiwan houses some of the major semiconductor manufacturing companies which are fueling the demand for advanced semiconductor packaging especially in PLPs. According to the Semiconductor Industry Association (SIA), Asia-Pacific generates more than 50% revenue for global semiconductor sales, this in turn, is providing Taiwanese vendors with an opportunity to supply FOWLP for increased semiconductor applications.

- Most of the companies in the country are expanding their production capacity of Fan-out packaging which is further expected to increase the exports and will also help in developing local market.

- For instance, ASE Group brought up a FO-WLP line, in Kaohsiung, Taiwan, with other major OSATs in production or planning their launch phases for fan-out packaging. Also, Fab 3 in Hsinchu Science Park is expectd be the world's first fab that would commercially use fan-out panel-level packaging (FOPLP) technology as it starts operations in the second half of 2020, according to Powertech Technology Inc.

Regional Outlook of Fan Out Packaging Market report includes the following geographic areas such as: North America, Europe, China, Japan, Southeast Asia, India and ROW.

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What Are The Market Factors That Are Explained In The Report?

Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a global and regional scale.

Analytical Tools: The Fan Out Packaging Market Report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, SWOT analysis, feasibility study, and investment return analysis have been used to analyze the growth of the key players operating in the market.

Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

Customization of the Report: This report can be customized as per your needs for additional data up to 3 companies or countries or 40 analyst hours.

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