Press release
Growing Consumption Of Embedded Circuitries From Electronic Industry Is Contributing Towards Increased Demand For Die Bonding Pastes
About the ReportThe global die bonding pastes market is set to expand at a steady CAGR of around 5% throughout the 2021-2031 assessment period. Die bonding pastes have vast application in the field of electrical and electronics, these pastes are mostly used in SMT assemblies, semiconductor packaging, and LED/optoelectronics.
To Get In-depth Information View Full Report – https://www.factmr.com/report/die-bonding-pastes-market
Die bonding pastes are used to attach semiconductor components/wafers to PCBs (printed circuit boards). In addition to bonding, they can help mitigate stress during system operation. Some die bonding pastes are both, thermally conductive and electrically insulating. They are available in various types in the form of sintering pastes, semi-sintering pastes, solder pastes, and epoxy.
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What are the Primary Applications that Generate Demand for Die Bonding Pastes Market?
Semiconductor packaging and SMT assembly application are two major application sides that collectively account for more than fifty percent of the market share from the consumption side. Growing consumption of embedded circuitries from the electrical and electronic industry is contributing towards increased demand for die bonding pastes.
Despite the presence of other die bonding materials such as die bonding wires, films, etc., these application industries are majorly giving importance to die bonding pastes owing to their high electronic properties, life cycle, and other myriad benefits.
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What are the Upcoming Trends in This Market?
Die bonding paste manufacturers and stencil manufacturers are facing newer challenges with the trend of miniaturisation of electronics. Smaller components such as 0603 metrics, 0402 metrics, and 0.4 mm pitch BGAs (ball grid arrays) are becoming more popular, prompting end-use customers to upgrade from type 3 to type 4 or type 4.5 solder pastes.
Ceramic-type stencil nano-coatings, such as NanoSlic Gold, are becoming more popular in addition to changing solder paste size. Ceramic nano-coatings such as NanoSlic Gold increase transfer efficiency and minimise variation in the solder paste printing process. All these points have been supporting increasing consumption of type 4 or 4.5 solder pastes. Owing to these factors, manufacturers of die bonding pastes are investing in type 4 or 4.5 soldering paste, following which, tier 2 and 3 players are also following the same.
Key Market Segments Covered
By Conductivity
Conductive Die Bonding Pastes
Non-conductive Die Bonding Pastes
By Paste
Sintering Paste
Semi-Sintering Paste
Solder Paste
Epoxy Paste
Silver-Glass Paste
By Application
Die Bonding Pastes for SMT Assemblies
Die Bonding Pastes for Semiconductor Packaging
Die Bonding Pastes for LED/Optoelectronics
Others
By End-use Industry
Die Bonding Pastes for Consumer Electronics
Die Bonding Pastes for Industrial Use
Die Bonding Pastes for Automotive
Die Bonding Pastes for Medical
Die Bonding Pastes for Communications
Region
North America
Europe
East Asia
South Asia & Oceania
Rest of World
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Key Questions Answered in Report
How will the market expand until 2031?
Fact.MR projects the market to register a CAGR around 5% across the 2021-2031 assessment period. Higher penetration in the consumer electronics and communications industry is set to bolster demand over the coming years.
Which country is contributing towards market growth?
As per Fact. MR’s projections, China is expected to hold a pivotal role driving demand for die bonding pastes. Surge in demand from the semiconductor packaging industry and SMT assembly industry is set to be observed across the country.
Which players are prevalent in this landscape?
Prominent players manufacturing die bonding pastes include Indium, Henkel Adhesives, Alpha Assembly Solutions, Sumitomo Bakelite, Asahi Solder, AI Technology, Showa Denko Materials (America) Inc., Tamura, Nordson EFD, Shenmao Technology, Inkron, AIM, Heraeu, DoW, and SMIC (Senju Metal Industry Co.).
For More Insights- https://www.einpresswire.com/article/556336214/in-line-with-carbon-sequestration-and-water-retention-properties-of-biochar-drives-the-industry
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