3D TSV Devices Market 2021 Analysis by Global Manufacturers – Amkor Technology, Inc., GLOBALFOUNDRIES, Micron Technology, Inc., Samsung Electronics Co., Ltd., SK Hynix Inc

The 3D TSV Devices Market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

The 3D TSV Devices Market was valued at USD 2.80 billion in 2019 and is expected to reach USD 4.02 billion by 2025, at a CAGR of 6.2% over the forecast period 2020 - 2025.

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Top Leading Companies of 3D TSV Devices Market are Amkor Technology, Inc., GLOBALFOUNDRIES, Micron Technology, Inc., Samsung Electronics Co., Ltd., SK Hynix Inc., Sony Corporation, STATS ChipPAC Ltd., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Teledyne DALSA Inc., Tezzaron Semiconductor Corp., United Microelectronics Corporation (UMC), Xilinx Inc. and others.

Industry News and Updates

April, 2019 - TSMC certified ANSYS (ANSS) solutions for its innovative System-on-Integrated-Chips (TSMC-SoIC) advanced 3D chip stacking technology. SoIC is an advanced interconnect technology for multi-die stacking on system-level integration using Through Silicon Via (TSV) and chip-on-wafer bonding process enabling customers with greater power efficiency and performance for highly complex and demanding cloud and data center applications.

Key Market Trends

Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period

- Asia-Pacific is the fastest growing market as countries in the region such as China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV market.

- Asia-Pacific is also one of the most active manufacturing hubs in the world. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. As silicon wafers are widely used to manufacture smartphones, the introduction of 5G technology is expected to boost the sales of 5G smartphones which will grow the market in the telecommunication sector.

- In April 2019, in Korea, collective laser_assisted bonding process for 3D TSV integration with NCP( nonconductive paste) is made, where several TSV dies can be stacked simultaneously to improve the productivity while maintaining the reliability of the solder joints through Laser_assisted bonding (LAB) advanced technology. This solder joints will increase the growth in consumer and commercial segments, which will increase the growth of the market.

Regional Outlook of 3D TSV Devices Market report includes the following geographic areas such as: North America, Europe, China, Japan, Southeast Asia, India and ROW.

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What Are The Market Factors That Are Explained In The Report?

Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a global and regional scale.

Analytical Tools: The 3D TSV Devices Market Report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, SWOT analysis, feasibility study, and investment return analysis have been used to analyze the growth of the key players operating in the market.

Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

Customization of the Report: This report can be customized as per your needs for additional data up to 3 companies or countries or 40 analyst hours.

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