Advanced Packaging Technologies Market 2021 Strategic Assessment- Amkor Technology, Intel, Advanced Semiconductor Engineering (ASE), Taiwan Semiconductor Manufacturing Company, Samsung Electronics

Global Advanced Packaging Technologies Market 2021 research report offers qualitative and quantitative insights in relation to industry growth rate, market segmentation, Advanced Packaging Technologies market size, demand and revenue. The current Advanced Packaging Technologies market trends that are expected to influence the future prospects of the industry are analyzed in the report. The report further investigates and assesses the current landscape of the ever-evolving business sector and the present and future effects of COVID-19 on the market.

The global advanced packaging technologies market is expected to grow from $4.31 billion in 2020 to $4.94 billion in 2021 at a compound annual growth rate (CAGR) of 14.7%. The growth is mainly due to the companies resuming their operations and adapting to the new normal while recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $8.11 billion in 2025 at a CAGR of 13.2%.

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Industry News:

In December 2020, Graham Partners, Inc, a US-based private investment firm focused on investing in technology-driven companies acquired flexible packaging converting the business from Berry Global for an undisclosed amount. The flexible packaging converting business will be combined with Graham Partners flexible packaging portfolio company, Advanced Barrier Extrusions LLC. Through this acquisition, ABX expands geographically, adds attractive categories such as personal care and healthcare packaging, and increases its revenue by over $200 million, according to Graham Partners. Berry Global is a US-based manufacturer and marketer of advanced plastic packaging products.  

Scope of this Report:

Markets Covered: 1) By Type: 3D Integrated Circuit; 2D Integrated Circuit; 2.5D Integrated Circuit; Others
2) By Product: Active Packaging; Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport; Consumer Electronics; Industrial; IT And Telecommunication; Others
Companies Mentioned: Amkor Technology; Intel; Advanced Semiconductor Engineering (ASE); Taiwan Semiconductor Manufacturing Company; Samsung Electronics
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.

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Executive Summary:

The main types of advanced packaging technologies are 3D integrated circuit, 2D integrated circuit, 2.5D integrated circuit and others. The 3D integrated circuit provides high bandwidth, small form factor and multi-function integration in packaging. Three-Dimensional Integrated Circuit (3DIC) is a packaging technology that collects and stacks homogeneous or heterogeneous dies vertically into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV). The various types of products include active packaging, smart and intelligent packaging and is implemented in various verticals such as automotive and transport, consumer electronics, industrial, IT and telecommunication, others. Electronic devices must give more functionality with more processing power and faster speeds, resulting in increased module complexity. Advanced packaging technologies provide very reliable materials, function well, and are minimal in cost. For instance, global consumer electronics revenues are predicted to expand by 3.6% year over year (YoY) to $1.06 trillion in 2021. Additionally, according to the India Brand Equity Foundation (IBEF) report, in 2019, the Indian appliance and consumer electronics (ACE) industry were valued at $10.93 billion (Rs. 76,400 crores), and it is predicted to double by 2025, reaching $ 21.18 billion (Rs. 1.48 lakh crore). Therefore, the growing demand for consumer electronics propels the growth of the advanced packaging market.

Regional Analysis For Advanced Packaging Technologies Market:

North America (The United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, and Italy)
Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
South America (Brazil, Argentina, Colombia, etc.)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)

Asia Pacific was the largest region in global advanced packaging technologies market in 2020. The regions covered in this report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

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Important Features that are under Offering and Key Highlights of the Reports:

– Detailed overview of Market

– Changing market dynamics of the industry

– In-depth market segmentation by Type, Application etc.

– Historical, current and projected market size in terms of volume and value

– Recent industry trends and developments

– Competitive landscape of Market

– Strategies of key players and product offerings

– Potential and niche segments/regions exhibiting promising growth

The research includes historic data from 2015 to 2021 and forecasts until 2030 which makes the report an invaluable resource for industry executives, marketing, sales, and product managers, consultants, analysts, and stakeholders looking for key industry data in readily accessible documents with clearly presented tables and graphs.

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