2.5D and 3D TSV Market Growth and Forecast 2021 to 2027 |Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology

The report provides a strategic analysis of the 2.5D and 3D TSV Market and growth estimates for the forecast period 2021-2027. The report provides qualitative and quantitative insights and detailed analysis of the market size and growth rate for all possible segments of the market. provide. This report focuses on the key drivers, restraints, opportunities and threats of key players. The report also focuses on 2.5D and 3D TSV market trends, volume and value at global level, regional level and company level.

The analysts forecast the global 2.5D and 3D TSV market to grow at a CAGR of 36.34 % during the period 2021- 2027.

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Top Companies Operating in the Global 2.5D and 3D TSV Market profiled in the report   are Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC, SK Hynix, Shinko, Unimicron, Fujitsu Interconnect, Xperi

INDUSTRY NEWS

Samsung Electronics has acquired 29 companies, including 13 in the last 5 years. A total of 4 acquisitions came from private equity firms. It has also divested 7 assets.

Samsung Electronics’ largest acquisition to date was in 2016, when it acquired Harman International Industries for $8.0B. It’s largest disclosed sale occurred in 2016, when it sold Samsung Electronics - Printer Business to HP for $1.1B. Samsung Electronics has acquired in 7 different US states, and 9 countries. The Company’s most targeted sectors include internet software and services (29%) and software (18%).

MARKET OVERVIEW

The 3D TSV packaging technology is also gaining traction. It enables a reduced data transmission time between chips and the current existing wire bonding technology, resulting in significantly lower power consumption with faster speed. In 2019, 2.5D/3D TSV ICs witnessed the highest revenue CAGRs in the advanced packaging semiconductor market.Since 2016, TSV has been widely used in CMOS image sensors (CIS) of smartphones and is increasingly integrated into the high-end market segment for memory devices. In 2019, hardware, like High Bandwidth Memory (HBM) and CIS, accounted for most of TSV’s revenue.

By Product Type and Application Global 2.5D and 3D TSV market segmentation:

 Market segment by type includes:

5D TSV
3D TSV

 Market Segment by Application includes:

Mobile and Consumer Electronics
Communication Equipment
Automotive and Transportation Electronics
Other

Regional Outlook For 2.5D and 3D TSV Market:

North America, South America, Asia Pacific, Africa and Europe etc. have been studied at length based on different business parameters such as type, size, application and end users. The global 2.5D and 3D TSV Market is served for a niche market. This report presents a portfolio of different strategies and best practices for managing your business. This research report included some applicable sales methodologies that may affect business outcomes.

Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period

Asia-Pacific is the fastest-growing region for the market studied. The increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world. This is due to the rising population growth and urbanization. As per the GSM Association, more than four out of five connections may be smartphones by 2025. This trend is expected to increase the TSV technology usage for smartphones in this region. Industry 4.0 is also acting as one of the most emerging trends in Asia-Pacific.

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Key points covered by the TOC:

Overview:   Along with an extensive overview of the global 2.5D and 3D TSV market, this section provides an overview of the report to give an idea of the nature and content of the research study.

Analysis of Strategies of Key Players:   Market players can use this analysis to gain a competitive edge in the 2.5D and 3D TSV Market.

Study on Key Market Trends:   This section of the report provides an in-depth analysis of the latest and future trends in the 2.5D and 3D TSV market.

Market Forecast:   Buyers of the report have access to accurate and verified estimates of the total market size in terms of value and size. The report also provides consumption, production, sales and other forecasts for the 2.5D and 3D TSV market.

Regional Growth Analysis:   All major regions and countries have been included in the report. Regional analysis helps market players utilize untapped regional markets, prepare specific strategies for target regions, and compare the growth of all regional markets.

Market Analysis:   The report provides accurate and reliable forecasts of the market share of vital segments of the 2.5D and 3D TSV market. Market participants can use this analysis to make strategic investments in key growth pockets of the 2.5D and 3D TSV market.

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Research Methodology:

2.5D and 3D TSV Market report includes market size estimation for value (million USD) and volume (M Sqm). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 2.5D and 3D TSV Market, to estimate the size of various other dependent submarkets in the overall market.

The major players in the market have been identified through secondary research and their market share has been determined through primary and secondary research. All percentage shares, splits, and classifications were determined using secondary and identified primary sources.

How the report considered the impact of Covid-19:

All the reports we have listed are tracking the impact of COVID-19 on the market. While doing this, both upstream and downstream of the entire supply chain were considered. We will also provide additional COVID-19 update supplements/reports in our Q3 report when available, so please check with our sales team.

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