Press release
Wafer Bonder Market 2021 Analysis by Top Manufacturers – EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi
This report discusses many vital industry facets that influence Global Wafer Bonder industry acutely which includes extensive study of competitive edge, latest advancements, region-wise industry environment, contemporary market and manufacturing trends, leading market contenders, and current consumption tendency of the end user. The report also oversees market size, market share, growth rate, revenue, and CAGR reported previously along with its forecast estimation. The impact of the COVID-19, and also forecasts its recovery post-COVID-19. The report also presents forecasts for Sodium-ion Battery investments from 2021 till 2027.Wafer Bonder Market size is projected to grow from USD 887 million in 2021 to USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendors/manufacturers in the market. The key manufacturers covered in this report: EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE
Industry Recent Developments and Updates
SUSS MicroTec Launches XBC300 Gen2: New Platform for Permanent Wafer Bonding, Debonding and Cleaning- SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.
SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder- SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today.
EV Group Launches Next-Generation Fusion Wafer Bonding Equipment 'Bond Scale'- EV Group (EVG) announced that, at Semicon Korea 2019, it will introduce 'BONDSCALE', a new type of bonding equipment. Headquartered in Austria, EVG specializes in semiconductor wafer bonding and lithography equipment.
APPLIED MATERIALS INTRODUCES NEW TECHNOLOGIES AND CAPABILITIES FOR ACCELERATING THE SEMICONDUCTOR INDUSTRY’S HETEROGENEOUS INTEGRATION ROADMAP- Applied Materials, Inc. today introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration. Applied is combining its leadership technologies in advanced packaging and large-area substrates with industry collaborations to speed the availability of solutions that deliver simultaneous improvements in power, performance, area, cost and time to market (PPACt™).
Wafer Bonder Market Segmentation:
Breakdown Data by Type
MEMS
Advanced Packaging
CMOS
Others
Wafer Bonder Breakdown Data by Application
Semi-Automated Wafer Bonder
Automated Wafer Bonder
Regional and Country-level Analysis
The report offers an exhaustive geographical analysis of the global Wafer Bonder market, covering important regions, viz, North America, Europe, China, and Japan. It also covers key countries (regions), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
Strategic Points Covered in TOC:
The report focuses on global major leading industry players with information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials, equipment and downstream consumers analysis is also carried out. What's more, the Wafer Bonder industry development trends and marketing channels are analyzed. Finally, the feasibility of new investment projects is assessed, and overall research conclusions are offered.
Wafer Bonder market research includes the methodical description of the various factors such as the market growth and detailed information about the different company’s revenue, technological developments, production, and the various other strategic developments. The regional spaces of significant components, including the capacity, cost, price, technology, supplies, profit, and competition are analyzed.
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Wafer Bonder Analysis and Strategies Carry Out as below:
The report elucidates a gist of the tried-and-tested as well as innovative strategies undertaken by potential stakeholders with regards to the marketing of the product.
The sales channels chosen (that include direct as well as indirect marketing) by the companies are briefly enumerated in the Wafer Bonder market report.
The distributors of these products and a gist of the top-of-the-notch customers for the same are also encompassed in the study.
The report is inclusive of the pivotal driving forces influencing the commercialization landscape of the Wafer Bonder market and their impact on the revenue scale of this business sphere.
The rising product demand from the key geographies as well as the pivotal applications and potential business arenas are also included in the Wafer Bonder Market report.
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https://www.marketinsightsreports.com/report/purchase/06172984446?mode=su?Mode=S21
Note: All the reports that we list have been tracking the impact of COVID-19 on the market. Both upstream and downstream of the entire supply chain has been accounted for while doing this. Also, where possible, we will provide an additional COVID-19 update supplement/report to the report in Q3, please check for with the sales team.
Irfan Tamboli (Head of Sales) – Market Insights Reports
Phone: + 1704 266 3234
Mob: +91-750-707-8687
sales@marketinsightsreports.com
irfan@marketinsightsreports.com
MarketInsightsReports provides syndicated market research on industry verticals including Healthcare, Information and Communication Technology (ICT), Technology and Media, Chemicals, Materials, Energy, Heavy Industry, etc. MarketInsightsReports provides global and regional market intelligence coverage, a 360-degree market view which includes statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.
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