Advanced Semiconductor Packaging Market Analysis, Status and Business Outlook 2021- Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian

This report discusses many vital industry facets that influence Global Advanced Semiconductor Packaging industry acutely which includes extensive study of competitive edge, latest advancements, region-wise industry environment, contemporary market and manufacturing trends, leading market contenders, and current consumption tendency of the end user. The report also oversees market size, market share, growth rate, revenue, and CAGR reported previously along with its forecast estimation. The impact of the COVID-19, and also forecasts its recovery post-COVID-19. The report also presents forecasts for Sodium-ion Battery investments from 2021 till 2027.

Advanced Semiconductor Packaging Market was valued at USD 23.93 billion in 2020, and it is expected to reach a value of USD 38.16 billion by 2026, registering a CAGR of 7.84% over the forecast period

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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendors/manufacturers in the market. The key manufacturers covered in this report: Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian, Powertech Technology Inc, UTAC, Nepes, Walton Advanced Engineering, Kyocera, Chipbond, Chipmos

Latest Update and Developments

KLA launches new advanced semiconductor packaging techniques- US-based capital equipment company KLA has enhanced its systems portfolio for advanced packaging with the launch of new tools.  

Amkor Technology Announces Plans to Expand Advanced Packaging Technology Capacity with New Factory in Bac Ninh, Vietnam- TEMPE, Ariz., November 04, 2021--Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam.

May 2020 - Synapse Electronique, a Canadian equipment electronics manufacturer and EMS provider, integrated two Universal Instruments Fuzion Platform production lines in its Shawinigan, Quebec facility. Each line includes a Fuzion2-60 and FuzionXC2-37 Platform, providing the performance to meet Synapse’s long-term OEM throughput requirements and the flexibility to support stringent contract-manufacturing demands.

Aug 2020 - Samsung Electronics announced the availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for most advanced process nodes. X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of advanced applications, including 5G, artificial intelligence, high-performance computing, mobiles, and wearables.

Market Overview

IC packaging in the semiconductor industry has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product, owing to vast demand from across various end-user verticals of the industry.

The flip-chip and wafer-level packaging technologies have witnessed solid growth over the years, owing to a number of mainstream applications, primarily in high-end smartphones and tablets that are expected to meet the stringent size and power management requirements.

Japan holds a significant position in the semiconductor industry as it is home to some of the major IC chipset manufacturers and electronics industry. Moreover, in May 2020, a new report suggested that the country is planning on attracting semiconductor manufacturers, such as Taiwan Semiconductor Manufacturing Company (TSMC) and Intel. The government is expected to start an investigation to look into future prospects to bring the major chipmakers to the country. The Advanced Packaging Market is witnessing dominance by ten to fifteen significant players like Intel Corporation, Samsung Electronics Co. Ltd. The market is significantly driven by end-user revenue because of the demand for the latest technology and high-speed gadgets. The companies have a sustainable competitive advantage through innovations in this market, owing to the growing need for differentiated products for various applications. The constant evolution of technological developments in smartphones, tablets, wireless communications, etc., will positively impact this industry.

Advanced Semiconductor Packaging Market Segmentation:

Breakdown Data by Type

Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

Advanced Semiconductor Packaging Breakdown Data by Application

Fan-Out Wafer-Level Packaging (FO WLP)

Fan-In Wafer-Level Packaging (FI WLP)

Flip Chip (FC)

2.5D/3D

Others

Regional and Country-level Analysis

The report offers an exhaustive geographical analysis of the global Advanced Semiconductor Packaging market, covering important regions, viz, North America, Europe, China, and Japan. It also covers key countries (regions), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.

Strategic Points Covered in TOC:

The report focuses on global major leading industry players with information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials, equipment and downstream consumers analysis is also carried out. What's more, the Advanced Semiconductor Packaging industry development trends and marketing channels are analyzed. Finally, the feasibility of new investment projects is assessed, and overall research conclusions are offered.

Advanced Semiconductor Packaging market research includes the methodical description of the various factors such as the market growth and detailed information about the different company’s revenue, technological developments, production, and the various other strategic developments. The regional spaces of significant components, including the capacity, cost, price, technology, supplies, profit, and competition are analyzed.

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Advanced Semiconductor Packaging Analysis and Strategies Carry Out as below:

The report elucidates a gist of the tried-and-tested as well as innovative strategies undertaken by potential stakeholders with regards to the marketing of the product.
The sales channels chosen (that include direct as well as indirect marketing) by the companies are briefly enumerated in the Advanced Semiconductor Packaging market report.
The distributors of these products and a gist of the top-of-the-notch customers for the same are also encompassed in the study.
The report is inclusive of the pivotal driving forces influencing the commercialization landscape of the Advanced Semiconductor Packaging market and their impact on the revenue scale of this business sphere.
The rising product demand from the key geographies as well as the pivotal applications and potential business arenas are also included in the Advanced Semiconductor Packaging Market report.

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Note: All the reports that we list have been tracking the impact of COVID-19 on the market. Both upstream and downstream of the entire supply chain has been accounted for while doing this. Also, where possible, we will provide an additional COVID-19 update supplement/report to the report in Q3, please check for with the sales team.

Irfan Tamboli (Head of Sales) – Market Insights Reports
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MarketInsightsReports provides syndicated market research on industry verticals including Healthcare, Information and Communication Technology (ICT), Technology and Media, Chemicals, Materials, Energy, Heavy Industry, etc. MarketInsightsReports provides global and regional market intelligence coverage, a 360-degree market view which includes statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.

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