Semiconductor Assembly And Packaging Equipment Market 2021 - SWOT Analysis, Forthcoming Development, Industry Insights, Growth Rate, And Forecast

The Business Research Company offers "Semiconductor Assembly And Packaging Equipment Global Market Report 2021 - By Type (Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment), By Application (Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage), By End-User (OSATs, IDMs), COVID-19 Impact And Recovery" in its research report store. It is the most comprehensive report available on this market and will help gain a truly global perspective as it covers 60 geographies. The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by region and by country. It also compares the market’s historic and forecast growth and highlights important trends and strategies that players in the market can adopt.

The semiconductor assembly and packaging equipment market report describes and explains the global semiconductor assembly and packaging equipment market and covers 2015 to 2020, termed the historic period, and 2020 to 2025 termed the forecast period, along with further forecasts for the period 2025-2030. The report evaluates the market across each region and for the major economies within each region.

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The semiconductor assembly and packaging equipment market consists of sales of semiconductor assembly and packaging equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing equipment used for semiconductor assembly and packaging. Only goods and services traded between entities or sold to end consumers are included.

The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%. The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $21.39 billion in 2025 at a CAGR of 12.3%.

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Some of the major players of the semiconductor assembly and packaging equipment market are Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V., Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd., Teradyne Inc., Kulicke & Soffa Industries, ASE, Plasma-Therm., Besi, DIAS Automation, Rudolph Technologies.

The countries covered in the global semiconductor assembly and packaging equipment market are Argentina, Australia, Austria, Belgium, Brazil, Canada, Chile, China, Colombia, Czech Republic, Denmark, Egypt, Finland, France, Germany, Hong Kong, India, Indonesia, Ireland, Israel, Italy, Japan, Malaysia, Mexico, Netherlands, New Zealand, Nigeria, Norway, Peru, Philippines, Poland, Portugal, Romania, Russia, Saudi Arabia, Singapore, South Africa, South Korea, Spain, Sweden, Switzerland, Thailand, Turkey, UAE, UK, USA, Venezuela, Vietnam.

The regions covered in the global semiconductor assembly and packaging equipment market are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The global semiconductor assembly and packaging equipment market is segmented -
1) By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Others
3) By End-User: OSATs, IDMs

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Few Points From Table Of Content
1. Executive Summary
2. Semiconductor Assembly And Packaging Equipment Market Characteristics
3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies
4. Impact Of COVID-19 On Semiconductor Assembly And Packaging Equipment
5. Semiconductor Assembly And Packaging Equipment Market Size And Growth
…
26. Africa Semiconductor Assembly And Packaging Equipment Market
27. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market
29. Semiconductor Assembly And Packaging Equipment Market Future Outlook and Potential Analysis
30. Appendix

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