Advanced Semiconductor Packaging Market Precise Outlook- Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian, Powertech Technology Inc

The Advanced Semiconductor Packaging Market report provides the overall structure and business outlook of the global and regional industries. The study also involves the important Achievements of the market, Research & Development, new product launch, product responses, and regional growth of the leading competitors operating in the market on a global and local scale. This study provides information about the growth and revenue during the historic and forecasted period of 2026 to 2027. The structured analysis contains graphical as well as a diagrammatic representation of the global Advanced Semiconductor Packaging Market with its specific geographical regions.

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“Advanced Semiconductor Packaging Market was valued at USD 24.93 billion in 2020, and it is expected to reach a value of USD 38.62 billion by 2026, at a CAGR of 7.8% over the forecast period (2021 - 2026).”

Top leading Companies Profiled in Advanced Semiconductor Packaging Market Report are Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian, Powertech Technology Inc, UTAC, Nepes, Walton Advanced Engineering, Kyocera, Chipbond, Chipmos,

Latest Update and Developments

April 2020 - TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. The semiconductor manufacturing company is yet to deliver Apple’s next-gen 5nm mobile chip slated to release in the last quarter of this year. The earliest the company expects it to be ready for the masses is 2025.

July 2019 - Intel added new technology to advanced packaging with three new technologies co-EMIB, ODI, and MDIO for building chips out of smaller silicon die and boosting the bandwidth between them in a package.

Apr 18, 2015 KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging- KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical inspection of integrated circuit (IC) packages, leveraging high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. Both systems help IC manufacturers and outsourced semiconductor assembly and test (OSAT) facilities address challenges, such as finer feature sizes and tighter pitch requirements, as they adopt innovative packaging techniques.

Amkor to Supply Advanced Packaging for Latest MCU and SoC Designs From Sharp Microelectronics of the Americas- CAMAS, Wash.--(BUSINESS WIRE)--May 14, 2001--Sharp Microelectronics of the Americas (SMA), a U.S.-based division of Sharp Electronics Corporation, announced today that they have selected Amkor Technology (Nasdaq:AMKR) as the back-end manufacturing partner for their latest microcontroller (MCU) and System-on-Chip (SoC) designs.

Market Overview

Moreover, AI is driving the development of 3D TSV and heterogeneous integration technologies. The 3D integration is offering unequaled performances suiting exactly the pressing needs of AI applications. TSMC's CoWoS advanced packaging technology combines memory chips and logic computing in a 3-D way for high computing products targeting artificial intelligence, cloud computing, data center, and supercomputer applications. This 3-D integration gives way for power-efficient high-speed computing while reducing heat and CO2 emissions.

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$9.4 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.8 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association, the import of IC was witnessing an increase in the demand for the consecutive years from 2014. The Chinese government has deployed a multi-pronged strategy, which led to the support of domestic IC industry development to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the demand for advanced packaging.

Market Research Study Focus on these Types:

Fan-Out Wafer-Level Packaging (FO WLP)

Fan-In Wafer-Level Packaging (FI WLP)

Flip Chip (FC)

2.5D/3D

Others

Market Research Study Focus on these Applications:

Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

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Regional Analysis:

Asia-Pacific (China, India, Japan, South Korea, Australia, Indonesia, Malaysia, and Others), North America (United States, Canada, and Mexico), Central & South America (Brazil, and Rest of South America), Europe (Germany, France, UK, Italy, Russia, and Rest of Europe), Middle East & Africa (GCC Countries, Turkey, Egypt, South Africa and Other)

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Key Takeaways from Advanced Semiconductor Packaging Report

─Evaluate market potential through analyzing growth rates (CAGR %), Volume (Units) and Value ($M) data given at country level – for product types, end use applications and by different industry verticals

─Understand the different dynamics influencing the Advanced Semiconductor Packaging market – key driving factors, challenges and hidden opportunities.

─Get in-depth insights on your competitor performance – Advanced Semiconductor Packaging market shares, strategies, financial benchmarking, product benchmarking, SWOT and more

─Analyze the sales and distribution channels across key geographies to improve top-line revenues.

─Understand the industry supply chain with a deep dive on the value augmentation at each step, in order to optimize value and bring efficiencies in your processes.

─Get a quick outlook on the market entropy – M&A’s, deals, partnerships, product launches of all key players for the past 4 years.

─Evaluate the supply-demand gaps, import-export statistics and regulatory landscape for more than top 20 countries globally for the Advanced Semiconductor Packaging

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In conclusion, the Advanced Semiconductor Packaging market report presents the descriptive analysis of the parent market supported elite players, present, past and artistic movement information which is able to function as a profitable guide for all the Advanced Semiconductor Packaging Industry business competitors. Our expert research analyst’s team has been trained to provide in-depth market research reports from every individual sector which will be helpful to understand the industry data in the most precise way.

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