Advanced Packaging Market Share 2021 Strategies to Boost Growth, Development, Manufacturers, Industry Size, Trends with Covid-19 Impact till 2026 | Intel Corporation, STATS ChipPAC Pte. Ltd, Chipbond Technology Corporation

The "Advanced Packaging Market" provides analysis and insights regarding the various factors expected to be prevalent throughout the forecast period while providing their impacts on the Market’s growth. The rise in the aviation sector is escalating the growth of the Advanced Packaging Market. Increased adoption of superior technology consisting of synthetic intelligence and system learning, a developing quantity of records and growing utility of records answers through an extensive variety of ends person verticals consisting of banking, economic services, and insurance, authorities and public sector, telecommunications and IT, energy, healthcare and others are the foremost elements as a consequence of the increase of the market.

Key players in the global Advanced Packaging Market covered:

Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company, Limited, Advanced Semiconductor Engineering Inc., Intel Corporation, STATS ChipPAC Pte. Ltd, Chipbond Technology Corporation, Samsung Electronics Co. Ltd, Universal Instruments Corporation, SÜSS Microtec Se, Brewer Science, Inc.

Recent Development:

- April 2020 - TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. The semiconductor manufacturing company is yet to deliver Apples next-gen 5nm mobile chip slated to release in the last quarter of this year. The earliest the company expects it to be ready for the masses is 2025.
- July 2019 - Intel added new technology to advanced packaging with three new technologies co-EMIB, ODI, and MDIO for building chips out of smaller silicon die and boosting the bandwidth between them in a package.

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Market Overview:

The advanced packaging market was valued at USD 3716.07 million in 2019, and it is expected to reach a value of USD 7677.29 million by 2025, at a CAGR of 10.66% during the forecast period from 2020 to 2026.

-The innovation in packaging technology is related to the increase in the functional density of large system-on-chip solutions. As a result, the focus on heterogeneous integration and wafer-level packages has prompted the chip industry to lay a new set of solutions, collectively known as advanced packaging.

- Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years.

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Key Market Trends

Fan-out Wafer Level Packaging to witness significant growth rate

- Fan-out wafer-level packaging (FOWLP) has emerged as a promising technology to meet the ever-increasing demands of consumer electronic products. The significant advantages of this type of packaging are specific features such as substrate-less package, lower thermal resistance, and higher performance due to shorter interconnects combined with direct IC connection by thin-film metallization instead of the standard wire bonds or flip-chip bumps and more moderate parasitic effects.
- Fan-out wafer-level packaging (FOWLP) is the latest packaging trend in the field of microelectronics. With various technological developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package approaches, larger substrate formats are targeted with the help of FOWLP.

Key questions answered in this report:

What are the current market trends and dynamics in the circulating Advanced Packaging market and valuable opportunities for emerging players?
Estimated forecast and market projections up to 2026
Which segment accounts for the fastest CAGR during the forecast period?
Which is the largest regional market for circulating the Advanced Packaging market?
What is the market trend and dynamics in emerging markets such as Asia Pacific, Latin America, and Middle East & Africa?
The worldwide market value of the circulating Advanced Packaging market in 2021 and 2026
Which are the key trends driving the global circulating Advanced Packaging market growth?
Who are the leading service providers in the circulating Advanced Packaging market worldwide?

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Asia-Pacific is expected to witness a significant growth rate

- Asia-Pacific is expected to grow at a significant rate. It has been a major revenue-generating region during the forecast period, primarily due to the growing population and the customer-side demand. Major semiconductor manufacturing companies present were present for a significant amount of time in the region are fueling the need for advanced semiconductor packaging. By prioritizing enhancements in end-to-end yield, semiconductor companies based in the Asia-Pacific region are managing cost pressures and efficiently sustaining higher profitability. The path forward involves a shift in mindsets, as well as the deployment of advanced packaging solutions.

Effect of COVID-19:

Advanced Packaging Market report investigates the effect of Coronavirus (COVID-19) on the industry. Since December 2019, the COVID-19 infection has spread to practically 180+ nations around the world with the World Health Organization pronouncing it a general wellbeing crisis. The worldwide effects of the Covid infection 2019 (COVID-19) are now beginning to be felt, and will essentially influence the market in 2020

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