Advanced Packaging Market 2021 Key Players, Industry Demand, Overview And Supply Chain Analysis - Amkor Technology, Inc., Intel Corporation, STATS ChipPAC Pte. Ltd

The Advanced Packaging Market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

The advanced packaging market was valued at USD 3716.07 million in 2019, and it is expected to reach a value of USD 7677.29 million by 2025, at a CAGR of 10.66% during the forecast period from 2020 to 2025.

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Top Leading Companies of Advanced Packaging Market are Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company, Limited, Advanced Semiconductor Engineering Inc., Intel Corporation, STATS ChipPAC Pte. Ltd, Chipbond Technology Corporation, Samsung Electronics Co. Ltd, Universal Instruments Corporation, S†SS Microtec Se, Brewer Science, Inc. and others.

Industry News and Updates

April 2020 - TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. The semiconductor manufacturing company is yet to deliver Apple's next-gen 5nm mobile chip slated to release in the last quarter of this year. The earliest the company expects it to be ready for the masses is 2025.

July 2019 - Intel added new technology to advanced packaging with three new technologies co-EMIB, ODI, and MDIO for building chips out of smaller silicon die and boosting the bandwidth between them in a package.

Key Market Trends

Fan-out Wafer Level Packaging to witness significant growth rate

- The fan-out wafer-level packaging (FOWLP) technology is being perceived as an alternative to 2.5D packaging. Fan-out is capable of multiple dies, as compared to fan-in wafer-level chip-scale package (WLCSP) technology, that handles a single die. Fan-out technology gained popularity in 2016 when Apple integrated its 16 nm A10 application processor with the mobile DRAM in a single package inside the iPhone 7. Apple used TSMC's Integrated Fan-out (InFO) packaging technology, which the company had been developing since 2014.

- Moreover, TSMC is increasing its InFO-PoP packaging capacity for processing A13 processor chips that power the new iPhone SE devices. Several packaging organizations are moving closer to the production of panel-level fan-out packaging. This next-generation technology is expected to reduce the cost of today's fan-out packages. Nepes, Samsung, ASE are among the major players that have already installed the equipment in their panel-level fan-out lines with production scheduled in 2019

- According to the industrial statistics from World Semiconductor Trade Statistics (WSTS), the global semiconductor market size reached an all-time high of USD 468.8 billion in 2018, up by 13.7% from the previous year. The Semiconductor Industry Association (SIA) announced the global semiconductor industry sales were USD 412.1 billion in 2019, which is a decrease of 12.1 percent compared to 2018. However, modest growth is expected in the coming years, which is expected to drive the use of fan-out wafer-level packaging for silicon wafers that are used in high-computing applications.

Regional Outlook of Advanced Packaging Market report includes the following geographic areas such as: North America, Europe, China, Japan, Southeast Asia, India and ROW.

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What Are The Market Factors That Are Explained In The Report?

Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a global and regional scale.

Analytical Tools: The Advanced Packaging Market Report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, SWOT analysis, feasibility study, and investment return analysis have been used to analyze the growth of the key players operating in the market.

Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

Customization of the Report: This report can be customized as per your needs for additional data up to 3 companies or countries or 40 analyst hours.

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