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■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck)

09-10-2021 12:06 PM CET | Industry, Real Estate & Construction

Press release from: EDRAGON TECHNOLOGY CORPORATION

Patent Coulomb-Force E-Chuck

Patent Coulomb-Force E-Chuck

■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck)
● No ESD
● Workable in Vacuum Environments
● Be able to ​adsorb Metal / Semiconductor / Glass / Paper / Porous materials​
■ Main Product Portfolio
① (Move-Free) Thin Warpage Wafer Supporter
② (Wired) Robot Hand Holder
③ (Cordless) Battery Power Holder
④ Palm Holder
⑤ Anti-wrinkle Foil Holder
⑥ 2D Curved Holder
⑦ 3D Curved Holder
⑧​ AOI Holder (Black)
⑨ Huge Stitching Holder
⑩​ Other Custom E-Chucks
■ Main Handling Applications
(1) Big-Size Flat Film and Panel
(2) Big-Size Warp Wafer Transfer and Moving
(3) Semiconductor BGBM Thin Wafer
(4) Thin Warp Wafer
(5) Move-Free Shape Reinforcement
(6) Cupper Foil
(7) Soft Film
(8) Curved Glass
(9) Vacuum Lamination in OLED, Touch Panel
(10) Vacuum deposition
https://edragoncorp.weebly.com/patent-coulomb-force-electrostatic-echuck.html

5F.-5, No. 513, Bo’ai St.,Zhubei City,
Hsinchu County 30265, ​Taiwan
​Email: sales@edragontek.com

EDRAGON TECHNOLOGY CORPORATION provides many advanced solutions for semiconductor engineering and related automation solutions. EDRAGON is honored to propose practical and reliable solutions for customers. Welcome to contact EDRAGON, we will provide you professional services. EDRAGON should be one of your important partners to each potential markets, especially ASEAN, and Asia-Pacific Areas.

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