Advanced Packaging Technologies Market 2021, COVID-19 Impact Analysis, Industry Trends, Forecast To 2030
The advanced packaging technologies market report describes and explains the global advanced packaging technologies market and covers 2015 to 2020, termed the historic period, and 2020 to 2025 termed the forecast period, along with further forecasts for the period 2025-2030. The report evaluates the market across each region and for the major economies within each region.
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The advanced packaging technologies market consists of sales of advanced packaging technologies by entities (organizations, sole traders and partnerships) that provide various packaging techniques based on parameters such as power consumption, operating conditions, measurable size, and cost. Advanced packaging technologies are a collection of techniques that include 2.5D 3D-IC, wafer-level packaging, and more. It allows integrated circuits to be enclosed in a casing, which protects metallic parts from corrosion and physical damage.
The global advanced packaging technologies market is expected to grow from $4.31 billion in 2020 to $4.94 billion in 2021 at a compound annual growth rate (CAGR) of 14.7%. The growth in the advanced packaging technologies marke is mainly due to the companies resuming their operations and adapting to the new normal while recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $8.11 billion in 2025 at a CAGR of 13.2%.
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Some of the major players of the advanced packaging technologies market are Amkor Technology, Intel, Advanced Semiconductor Engineering (ASE), Taiwan Semiconductor Manufacturing Company, Samsung Electronics, STATS ChipPAC, Qualcomm Technologies, IBM, Brewer Science, SÜSS Microtec, Renesas Electronics Corporation, Texas Instruments, Siliconware Precision Industries, Jiangsu Changjiang Electronics Technology, China WLCSP Co. LTD., Deca Technologies, Greatek Electronics, Powertech Technology, Sanmina Corporation, SFA Semicon, Universal Instruments Corporation, and Tongfu Microelectronics.
The countries covered in the global advanced packaging technologies market are Argentina, Australia, Austria, Belgium, Brazil, Canada, Chile, China, Colombia, Czech Republic, Denmark, Egypt, Finland, France, Germany, Hong Kong, India, Indonesia, Ireland, Israel, Italy, Japan, Malaysia, Mexico, Netherlands, New Zealand, Nigeria, Norway, Peru, Philippines, Poland, Portugal, Romania, Russia, Saudi Arabia, Singapore, South Africa, South Korea, Spain, Sweden, Switzerland, Thailand, Turkey, UAE, UK, USA, Venezuela, Vietnam.
The regions covered in the global advanced packaging technologies market are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The global advanced packaging technologies market is segmented -
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Others
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Others
Read More On The Global Advanced Packaging Technologies Market Report:
Few Points From Table Of Content
1. Executive Summary
2. Advanced Packaging Technologies Market Characteristics
3. Advanced Packaging Technologies Market Trends And Strategies
4. Impact Of Covid-19 On Advanced Packaging Technologies
5. Advanced Packaging Technologies Market Size And Growth
26. Africa Advanced Packaging Technologies Market
27. Advanced Packaging Technologies Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Advanced Packaging Technologies Market
29. Advanced Packaging Technologies Market Future Outlook And Potential Analysis
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