Automotive Power Module Packaging Market 2021 Global Competition and Business Outlook - Amkor Technology, Infineon Technologies, STMicroelectronics, Fuji Electric Co. Ltd.

The Market Insights Reports has added a new statistical data to its repository titled as, Global Automotive Power Module Packaging Market. It provides the industry overview with market growth analysis with a historical & futuristic perspective for the following parameters; cost, revenue, demands, and supply data (as applicable). Furthermore, the report also sheds light on recent developments and technological platforms, in addition to distinctive tools, and methodologies that will help to propel the performance of industries. It also presents a futuristic growth outlook of the Automotive Power Module Packaging Market in a pre- and post-COVID-19 scenario.

The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2020 - 2025).

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Top Key Players in the Global Automotive Power Module Packaging Market are Amkor Technology, Kulicke and Soffa Industries Inc., PTI Technology Inc., Infineon Technologies, STMicroelectronics, Fuji Electric Co. Ltd., Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC Ltd. (JCET), Starpower Semiconductor Ltd., and others.  

Scope of the Report

Packaging of automotive power modules needs to meet high-reliability standards like harsh operating environment (which includes high ambient temperature range, high operating temperature, temperature excursion, and thermal shock), mechanical vibration and shock, and frequent power surging. To ensure reliable operation of the power module, packaging of the power modules has been intensively modified in terms of packaging materials and processing as well as in terms of reliability design. The Electric Vehicle and Hybrid Electric Vehicle (EV/HEV) industry’s demand for high power density and mechatronics integration is the main driver for automotive power module packaging market.

Key Market Trend:

Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging

- Over the past decade, electric vehicle technologies have gained significant progress due to the added advancement in electric motor drives, power converters, on-board batteries and systems integration.
- Advanced electric drive vehicles such as hybrid-electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), range-extended electric vehicle (REEV) and pure electric vehicles (EVs) employed advanced power electronics devices to control the flow of electrical energy from the on-board battery to the traction motors and other accessories.
- In advanced power electronics systems, apart from control topology and components, packaging plays an important role to improve the overall efficiency and reliability.
- Initially, the automotive power module packaging followed the standard of industrial drive module packaging, using the well-established wire bond technology. Such a basic packaging structure has gone through significant improvements in the pursuit of better electrical and thermal performance, reliability and cost-effectiveness.
- Need for improving the present practice of packaging in power electronics modules is amplified due to the stringent requirements of electric vehicles. The pursuit for higher current density is expected to be continued, and it brings along with it a need for continued improvement of cooling. Advancement in power electronic packaging is essential to support these needs.

Investigator Observers Strong Growth in Specific Regions:

– North America (United States, Canada, Mexico)
– Europe (Germany, UK, France, Italy, Spain, Russia)
– Asia-Pacific (China, Japan, South Korea, Australia, India)
– South America (Brazil, Argentina, Columbia)
– The Middle East and Africa (UAE, Egypt, South Africa)        

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Important Features that are under Offering and Key Highlights of the Reports:

– Detailed overview of Market
– Changing market dynamics of the industry
– In-depth market segmentation by Type, Application etc.
– Historical, current and projected market size in terms of volume and value
– Recent industry trends and developments
– Competitive landscape of Automotive Power Module Packaging Market
– Strategies of key players and product offerings
– Potential and niche segments/regions exhibiting promising growth     

Frequently Asked Questions about Automotive Power Module Packaging Market:

–   Who are the key players operating in the Automotive Power Module Packaging Market?
–   Which is the leading segment in the market?
–   At What CAGR is the market projected to grow in the forecast period (2021-2025)?
–   What is the key factor driving the market?
–   Which data rates would lead the market during the forecast period?
–   Which region is expected to dominate the Automotive Power Module Packaging Market in the next five years?

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