Die Attach Machine Market Outlook 2020- Insights, Growth Analysis, Future Trends, Forecasts To 2028

Global die attach machine market size was valued at $1,129.0 million in 2020, and is projected to reach $1,813.1 million by 2028, registering a CAGR of 6.1% from 2021 to 2028.

Commonly observed types of die attach machine are flip chip bonder and die bonder. Among these, the die bonder segment accounted for the largest market size by value in 2020, owing to increase in demand from various industries such as semiconductor equipment, chip assembly, and others. The market is analyzed with respect to different applications such as RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. The market is mainly driven by global economic growth and development in hybrid chips, and semiconductor memory industry sectors. However, fluctuation in raw material prices restrain the growth of the die attach machine market.

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Leading Players:
Key companies profiled in the die attach machine market report include Anza Technology, Inc, ASM Pacific Technology Limited, BE Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co. Limited, Inseto UK Limited, Kulicke and Soffa Industries, Inc., MicroAssembly Technologies Limited, Palomar Technologies, and Shinkawa Limited.

Key Segments -

By Type
• Flip Chip Bonder
• Die Bonder

By Technique
• Epoxy
• Soft Solder
• Sintering
• Eutectic
• Others

By Application
• RF & MEMS
• Optoelectronics
• Logic
• Memory
• CMOS Image Sensors
• LED
• Others

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In 2020, Asia-Pacific dominated the global market, in terms of revenue, accounting for around 51.0% share of the global die attach machine industry, followed by Europe and North America. Moreover, the market in LAMEA is growing, owing to urbanization and economic development in developing countries such as Brazil, Argentina, and others.

Key Findings Of The Study:
• The report provides an extensive analysis of the current and emerging die attach machine market trends and dynamics.
• Depending on type, the die bonder segment dominated the die attach machine, in terms of revenue in 2020 and the flip chip bonder segment is projected to grow at a significant CAGR during the forecast period.
• By application, the LED segment registered highest revenue in 2020.
• Asia-Pacific is projected to register highest growth rate in the coming years.
• Depending on technique, the epoxy segment dominated the die attach machine market share, in terms of revenue in 2020, and is projected to grow at a significant CAGR during the forecast period.
• The report provides an extensive analysis of the current die attach machine market trends and emerging opportunities of the market.
• The key players within the are profiled in this report, and their strategies are analyzed thoroughly, which help understand competitive outlook of the die attach machine industry.
• In-depth die attach machine market analysis is conducted by constructing estimations for the key segments between 2021 and 2028.

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