Advanced Packaging Market 2021 SWOT Analysis and Key Business Strategies by Leading Players – Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company, Limited, Advanced Semiconductor Engineering Inc

Latest research on Advanced Packaging Market report covers forecast and analysis on a worldwide, regional and country level. The study provides historical information of 2016-2021 together with a forecast from 2021 to 2026 supported by both volume and revenue (USD million). The entire study covers the key drivers and restraints for the Advanced Packaging market. This report included a special section on the Impact of COVID19. Also, Advanced Packaging Market (By major Key Players, By Types, By Applications, and Leading Regions) Segment’s outlook, Business assessment, Competition scenario and Trends. The report also gives 360-degree overview of the competitive landscape of the Advanced Packaging industry.

The advanced packaging market was valued at USD 3716.07 million in 2019, and it is expected to reach a value of USD 7677.29 million by 2025, at a CAGR of 10.66% during the forecast period from 2021 to 2026.

The Advanced Packaging market is highly competitive and consists of a number of major players. Top Companies like Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company, Limited, Advanced Semiconductor Engineering Inc., Intel Corporation, STATS ChipPAC Pte. Ltd, Chipbond Technology Corporation, Samsung Electronics Co. Ltd, Universal Instruments Corporation, SÜSS Microtec Se, Brewer Science, Inc.

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Regional Analysis:

Furthermore, to broaden the understanding, researchers have studied the global Advanced Packaging market from a geographical point of view, considering the potential regions and countries. The regional analysis will assist the market players in making sound decisions regarding their future investments.

Advanced Packaging Market report includes the following geographic areas such as North America, Europe, China, Japan, Southeast Asia, India and ROW.

Industry News And Developments:

- April 2020 - TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. The semiconductor manufacturing company is yet to deliver Apple’s next-gen 5nm mobile chip slated to release in the last quarter of this year. The earliest the company expects it to be ready for the masses is 2025.

- July 2019 - Intel added new technology to advanced packaging with three new technologies co-EMIB, ODI, and MDIO for building chips out of smaller silicon die and boosting the bandwidth between them in a package.

Scope of the Report

- Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years.

- As people are shifting toward connected devices, an increase in the Internet of Things (IoT) will lead to the growth of semiconductor packaging. The growth in the demand for consumer wearable goods, smartphones, and home appliances will have a positive impact on this industry. With IoT being a significant driver, security is a primary concern for the user. The semiconductor manufacturers have to work to develop more secure chips continually.

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Key Market Trends

Fan-out Wafer Level Packaging to witness significant growth rate

- Fan-out wafer-level packaging (FOWLP) has emerged as a promising technology to meet the ever-increasing demands of consumer electronic products. The significant advantages of this type of packaging are specific features such as substrate-less package, lower thermal resistance, and higher performance due to shorter interconnects combined with direct IC connection by thin-film metallization instead of the standard wire bonds or flip-chip bumps and more moderate parasitic effects.

- Fan-out wafer-level packaging (FOWLP) is the latest packaging trend in the field of microelectronics. With various technological developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package approaches, larger substrate formats are targeted with the help of FOWLP. Hence, it is well suited for the packaging of a highly miniaturized energy harvester system consisting of a piezo-based harvester, a power management unit, and a supercapacitor for energy storage.

Asia-Pacific is expected to witness significant growth rate

- Asia-Pacific is expected to grow at a significant rate. It has been a major revenue-generating region during the forecast period, primarily due to the growing population and the customer-side demand. Major semiconductor manufacturing companies present were present from a significant amount of time in the region are fueling the need for advanced semiconductor packaging. By prioritizing enhancements in end-to-end yield, semiconductor companies based in the Asia-Pacific region are managing cost pressures and efficiently sustaining higher profitability. The path forward involves a shift in mindsets, as well as the deployment of advanced packaging solutions.

- Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association, the import of IC was witnessing an increase in the demand for the consecutive years from 2014. The Chinese government has deployed a multi-pronged strategy, which led to the support of domestic IC industry development to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the demand for advanced packaging.

What are the market factors that are explained in the report?

–Key Strategic Developments: The study also includes the key strategic developments of the market, comprising R&D, new product launch, M&A, agreements, collaborations, partnerships, joint ventures, and regional growth of the leading competitors operating in the market on a global and regional scale.

–Key Market Features: The report evaluated key market features, including revenue, price, capacity, capacity utilization rate, gross, production, production rate, consumption, import/export, supply/demand, cost, market share, CAGR, and gross margin. In addition, the study offers a comprehensive study of the key market dynamics and their latest trends, along with pertinent market segments and sub-segments.

–Analytical Tools: Advanced Packaging Market report includes the accurately studied and assessed data of the key industry players and their scope in the market by means of a number of analytical tools. The analytical tools such as Porter’s five forces analysis, feasibility study, and investment return analysis have been used to analyzed the growth of the key players operating in the market. 

The research includes historic data from 2015 to 2020 and forecasts until 2026 which makes the reports an invaluable resource for industry executives, marketing, sales and product managers, consultants, analysts, and other people looking for key industry data in readily accessible documents with clearly presented tables and graphs.

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