Chip Scale Package (CSP) LED Market Worth USD 3.52 Billion by 2028 | Top Key Players Seoul Semiconductor, LG Innotek, Lumileds, Samsung, etc

The Chip Scale Package (CSP) LED market is estimated to be USD 1.04 Billion in 2020 and is likely to reach USD 3.52 Billion by 2026, at a CAGR of 16.5% between 2019 and 2026. The manufacturing of Chip Scale Package LEDs involves a low bill of materials, due to the removal of several packaging steps as compared to traditional LED packaging process, is a major factor driving the growth of the Chip Scale Package LED market. Stiff competition in the LED packaging market has led to a strong consolidation within the market players in the development and launch of new and innovative CSP LEDs with improved designs and high-end specifications. Manufacturing process of traditional packaged LEDs usually undergo from the chip/die manufacturing to packaging processes where the dies are attached to an interposer or a ceramic substrate, which yields a packaged LED or more commonly known as an LED package. CSP LED, on the other hand eliminates the separate steps of having manufactured chips going through a packaging line. This is because, at the die-level itself, the chips are singulated and coated with phosphor. Solder pads or bond pads are attached at the wafer level immediately after the epitaxial stage of manufacturing with the help of semiconductor etching and metallization techniques. Chip Scale Package LEDs becomes installation ready on a PCB as soon as the wafer is diced.

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Market Overview:

The information and communication technology sector is expanding at a robust pace over the recent past. Technological advancements in the ICT sector, Artificial Intelligence and robots, increasing demand for smartphones, laptops equipped with latest technologies, and growing adoption of cloud services and IOT are key factors boosting market growth. Rising investments in research and development activities, and increasing usage of internet services, social networking, are fueling global market growth. In addition, rising focus on data security, increasing enhanced techniques to store large amount of data and rising demand for smart and wireless devices are further fueling global Chip Scale Package (CSP) LED market growth.

Competitive Landscape:

The global Chip Scale Package (CSP) LED market is extremely competitive and Dominant players in the global Chip Scale Package (CSP) LED market are developing various strategies such as mergers and acquisitions, new product launches, investment in research and development activities, corporate deals, and partnerships to strengthen their market position and expand their product base.

Key companies operating in the market:

Seoul Semiconductor (South Korea), LG Innotek (South Korea), Lumileds (The Netherlands), Samsung (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea)

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Key questions addressed in the global Chip Scale Package (CSP) LED market report:

What revenue CAGR is the global Chip Scale Package (CSP) LED market projected to register over the forecast period?

What are the key outcomes of Porter’s Five Force analysis of the global Chip Scale Package (CSP) LED market?

What are the key restraints hampering global market growth?

Which region is expected to account for largest revenue share between 2021 and 2028?

Which key players are operating in the global Chip Scale Package (CSP) LED market?

The global Chip Scale Package (CSP) LED market is further segmented into type and application:

Application Outlook (Revenue, USD Million; 2020–2028)

Backlighting Unit (BLU)

General Lighting

Automotive Lighting

Flash Lighting

Others

Power Range Outlook (Revenue, USD Million; 2020–2028)

Low- & Mid-Power

High-Power

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Regional Analysis:

Regional Outlook of Chip Scale Package (CSP) LED Market:

North America

Europe

Asia Pacific

Latin America

Middle East & Africa

Table Of Contents:

Chapter 1. Market Synopsis

1.1. Market Definition

1.2. Research Scope & Premise

1.3. Methodology

1.4. Market Estimation Technique

Chapter 2. Executive Summary

2.1. Summary Snapshot, 2020 – 2028

Chapter 3. Indicative Metrics

3.1. Macro Indicators

3.1.1. LED Packaging Market

3.1.2. Camera Flash Market

3.1.3. Display Backlighting

Chapter 4. CSP LED market Segmentation & Impact Analysis

4.1. CSP LED market Segmentation Analysis

4.2. CSP LED market Value Chain Analysis, 2018-2026

4.3. CSP LED market Impact Analysis

4.3.1. Market driver analysis

4.3.1.1. Low Bill of materials Due to Removal of Several Packaging Steps

4.3.1.2. Reduced Form Factor, Wider Beam Angle, and High Package Density

4.3.1.3. Low Thermal Resistance and Uniform Current Spreading

4.3.2. Market restraint analysis

4.3.2.1. Increased burden on LED Foundries

4.3.2.2. Commercialization in Premium Products

4.3.3. Market opportunities

4.3.3.1. Automotive Lighting Market

4.3.3.2. General Lighting Market

4.3.3.3. CSP LEDs with GaN-on-Si

4.3.4. Market Challenges

4.3.4.1. Lack of uniformity in Heat Dissipation and other Thermal Challenges for Module Designers

4.3.4.2. Direct Exposure to Environment

4.4. Industry analysis - Porter's Analysis

4.5. CSP LED market Competitive scenario, 2018

Continued…

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