Silicon Carbide (SiC) Semiconductor Market 2021 Competitive Analysis with Future Prospects: icrochip Technology, Norstel AB, Renesas Electronics Corporation, ROHM Co Ltd, STMicroelectronics N.V, Toshiba Corporation

Global Silicon Carbide (SiC) Semiconductor Market 2021 offers specified research and evaluation of the COVID-19 impact provided in-depth information on leading growth drivers, limitations, challenges, trends, and occasions to offer a comprehensive analysis of the global Silicon Carbide (SiC) Semiconductor market. Market participants can use the analysis on market dynamics to plan effective growth strategies and prepare for future challenges beforehand. Each trend of the global Silicon Carbide (SiC) Semiconductor market is carefully analyzed and researched about by the market analysts.

The global Silicon Carbide (SiC) Semiconductor market size is estimated to grow from USD 750 million in 2021 to USD 1,813 million by 2027 at a CAGR of 19.8%.

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The 200+ pages report presents the market competitive landscape and a corresponding detailed analysis of the major vendor/key players in the market. Top Companies in the Global Silicon Carbide (SiC) Semiconductor Market: Cree Incorporated, Fairchild Semiconductor International Inc, Genesic Semiconductor Inc, Infineon Technologies Ag, Microchip Technology, Norstel AB, Renesas Electronics Corporation, ROHM Co Ltd, STMicroelectronics N.V, Toshiba Corporation and others.

Industry News:

May 10, 2021: Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed package technology for silicon carbide (SiC) power modules that doubles their reliability [1] and reduces their footprint by 20%

SiC realizes higher voltages and lower losses than silicon, and is widely seen as the next-generation material for power devices. While use now centers on inverters for trains, wider deployment in high-voltage applications is on the horizon, including in photovoltaic power systems and automotive equipment. Reliability is the main concern that has limited use of SiC devices. Application in high voltage power modules requires that not only the semiconductor chip but also the package itself delivers high-level reliability. Toshiba has achieved this with a new silver (Ag) sintering technology for die bonding.

Market Segmented by Types:

SIC Power Semiconductors

SIC Power Semiconductor Devices

SIC Power Diode Nodes

Market Segmented by Applications:

Automotive

Aerospace and Defense

Computers

Consumer Electronics

Industrial

Healthcare

Power Sector

Solar

Regional Analysis:

– North America (United States, Canada, Mexico)

–Europe (Germany, UK, France, Italy, Spain, Russia)

–Asia-Pacific (China, Japan, South Korea, Australia, India)

–South America (Brazil, Argentina, Columbia)

–The Middle East and Africa (UAE, Egypt, South Africa)

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Important Features that are under Offering and Key Highlights of the Reports:

– Detailed overview of Market

– Changing market dynamics of the industry

– In-depth market segmentation by Type, Application etc.

– Historical, current and projected market size in terms of volume and value

– Recent industry trends and developments

– Competitive landscape of Market

– Strategies of key players and product offerings

– Potential and niche segments/regions exhibiting promising growth

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