[PDF] What segments are covered in 3D ICs Industry report?

3D ICs Market Perspective 2021

𝗥𝗲𝗽𝗼𝗿𝘁 𝗣𝗮𝗴𝗲𝘀: [140 Pages]

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. A very broad term that includes such technologies as 3D wafer-level packaging (3D WLP); 2.5D and 3D interposer-based integration, 3D stacked ICs (3D-SIC), monolithic 3D ICs, 3D heterogeneous integration, and 3D systems integration. In contrast: 3D transistors refers to FinFETs.

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3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip chip to achieve vertical stacks. Examples of 3D packages include package-on-package (PoP) where individual die are packaged, and the packages are stacked and interconnected with wire bonds or flip-chip processes; and 3D wafer-level packaging (3D WLP) that uses redistribution layers (RDL) and bumping processes to form interconnects. Three-dimensional integrated circuit (3D IC) and 2.5D IC with Si interposer are regarded as promising candidates to overcome the limitations of Moore’s law because of their advantages of lower power consumption, smaller form factor, higher performance, and higher function density

𝗙𝗿𝗲𝗾𝘂𝗲𝗻𝘁𝗹𝘆 𝗔𝘀𝗸𝗲𝗱 𝗤𝘂𝗲𝘀𝘁𝗶𝗼𝗻𝘀 (𝗙𝗔𝗤) :

𝗪𝗵𝗮𝘁 𝗶𝘀 𝘁𝗵𝗲 𝗺𝗮𝗿𝗸𝗲𝘁 𝘀𝗶𝘇𝗲, 𝘀𝗵𝗮𝗿𝗲 𝗼𝗳 3D ICs ?

𝗬𝗲𝘀, The global 3D ICs market was valued at US$ 7,521.4 Mn in 2019 and is forecast to reach a value of US$ 38,252.9 Mn by 2027 at a CAGR of 22.5% between 2020 and 2027.

𝗪𝗵𝗼 𝗮𝗿𝗲 𝘁𝗵𝗲 𝗸𝗲𝘆 𝗰𝗼𝗺𝗽𝗮𝗻𝗶𝗲𝘀/𝗽𝗹𝗮𝘆𝗲𝗿𝘀 𝗶𝗻 𝘁𝗵𝗲 3D ICs?

𝗬𝗲𝘀, You can add Specific 𝗖𝗼𝗺𝗽𝗮𝗻𝘆 𝘂𝗽𝘁𝗼 𝟯 𝗖𝗼𝗺𝗽𝗮𝗻𝗶𝗲𝘀.

Companies Covered as part of this study include: Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.,

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