3D Semiconductor Packaging Market Size to reach $7272.7 Million by 2027

The global 3D Semiconductor Packaging market size is projected to reach US$ 7272.7 million by 2027, from US$ 2452.4 million in 2020, at a CAGR of 16.8% during 2021-2027.

3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip chip to achieve vertical stacks. Examples of 3D packages include package-on-package (PoP) where individual die are packaged, and the packages are stacked and interconnected with wire bonds or flip chip processes; and 3D wafer-level packaging (3D WLP) that uses redistribution layers (RDL) and bumping processes to form interconnects.

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Consumer Electronics industry contributed over 54% of the overall 3D semiconductor packaging market in 2018. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 17.82% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide.

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Global 3D Semiconductor Packaging Scope and Market Size

3D Semiconductor Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D Semiconductor Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type

o 3D Wire Bonding
o 3D TSV
o 3D Fan Out
o Others

3D Wire Bonding Occupy the largest market share segment reached 44%

Segment by Application

o Consumer Electronics
o Industrial
o Automotive & Transport
o IT & Telecommunication
o Others

Consumer Electronics has the largest market share segment with 54% and the fastest growth

BY COMPANY

o lASE
o Amkor
o Intel
o Samsung
o AT&S
o Toshiba
o JCET
o Qualcomm
o IBM
o SK Hynix
o UTAC
o TSMC
o China Wafer Level CSP
o Interconnect Systems

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