Semiconductor Packaging Market 2021 Strategic Assessments and Business Scenario – ASE Group, Amkor Technology, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil)

The Global Semiconductor Packaging Market Research Report 2021-2026 is a valuable source of insightful data for business strategists. It provides the industry overview with growth analysis and historical & futuristic cost, revenue, demand, and supply data (as applicable). The research analysts provide an elaborate description of the value chain and its distributor analysis. This Market study provides comprehensive data which enhances the understanding, scope, and application of this report.

The semiconductor packaging market was valued at USD 28.2 billion in 2019 and is expected to be worth USD 44.44 billion by 2025, recording a CAGR of 7.96% over the forecast period (2020-2025).

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Key Market Players: ASE Group, Amkor Technology, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology, Inc., Tianshui Huatian Technology Co. Ltd, Fujitsu Ltd, UTAC Group, Chipmos Technologies, Inc., Chipbond Technology Corporation, Intel Corporation, Samsung Electronics Co. Ltd, Unisem (M) Berhad, Interconnect Systems, Inc. (ISI) and Other

Industry News and Updates:

- July 2020 - ASE Group completed its strategic agreement with Apple Inc to steadily improve its energy efficiency and steadily shift into the greener production. Moreover, this partnership supports clean energy within the supply chain and its supplier clean energy program. It will also create a vast brand reputation for this company.
- December 2019 - SUSS MicroTec, equipment, and process solutions provider announced to enter a partnership with BRIDG to invest in focused production process technologies, advanced system integration, and 200mm MEMS fabrication to advancing next-generation nanoscale technology.

Key Market Trends

Consumer Electronics Industry to Augment the Market Growth

- The electronics market continually demands higher power dissipation, faster speeds, higher pin counts, and smaller footprints and lower profiles. The miniaturization and integration of semiconductors have given rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices.
- Each new iteration of consumer electronics products is smarter, lighter, and more energy-efficient than its predecessors. This creates huge expectations among customers for the next iteration, which is a major selling point for the producers of consumer electronics.
- The rising penetration of consumer electronics in the high growth regions of the world has led to increased capital investment by several wafer manufacturing companies, in a bid to meet the demand. Therefore, the demand for defect-free chips will drive the growth of this market. Recently SEMICON EUROPA highlighted that there was an estimated increase of 25% in Semiconductor Fabrications Investment in China from 2018 to 2019. China was reported to be followed by the USA at 24% and Taiwan at 15% for the same period.
- In addition to this, smartphones are one of the most significant contributors to the consumer electronics segment's semiconductor consumption. According to the Consumer Technology Association(CTA), smartphone sales have been estimated to be 77.5 billion in 2019. With this trend likely to continue, it is poised to drive the semiconductor demand, in turn, augmenting the packaging market growth

North America Expected to Hold a Significant Share

- With the high use of MEMS-based semiconductors in North America across the end-user industries such as in healthcare are expected to drive the demand for semiconductor packaging market in the region. The United States is also the frontrunner in semiconductor packaging innovation, boasting more than 80 wafer fabrication plants spread across 19 states.
- Government entities in the region are also investing extensively in the MEMS-based semiconductor chips' manufacturing facilities for their application in healthcare. For instance, in June 2019, NASA invested USD 125,000 as phase-I funding for the project by Techshot to develop in-Space manufacturing of microfluidic chips for use in biological research aboard the International Space Station.
- Apart from this, major players' investments in the country are set to fuel the semiconductor packaging market. For instance, in 2019, Cree Inc announced plans to invest more than USD 1 billion to open a new semiconductor factory in the USA. This semiconductor factory is expected to be ready by the year 2022. Besides, the growing prominence of Chinese semiconductor products is expected to further push innovations in the region's semiconductor industry.
- In addition to this, smartphones are one of the most significant contributors toward semiconductor consumption in the consumer electronics segment. In recent years, the United States has witnessed consistent growth in smartphone sales. With this trend likely to continue, it is poised to drive the semiconductor demand. In turn, they are augmenting the packaging market growth.

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What are the market factors that are explained in the report?

Executive Summary: It includes key trends of the global Semiconductor Packaging market related to products, applications, and other crucial factors. It also provides an analysis of the competitive landscape and CAGR and market size of the global Semiconductor Packaging market based on production and revenue.

Production and Consumption by Region: It covers all regional markets focusing on the research study. It discusses prices and key players besides production and consumption in each regional market.

Key Players: Here, the report throws light on financial ratios, pricing structure, production cost, gross profit, sales volume, revenue, and gross margin of leading and prominent companies competing in the global Semiconductor Packaging market.

Market Segments: This part of the report discusses product type and application segments of the global Semiconductor Packaging market based on market share, CAGR, market size, and various other factors.

Research Methodology: This section discusses the research methodology and approaches Semiconductor Packaging used to prepare the report. It covers data triangulation, market breakdown, market size estimation, and research design and/or programs.

The research includes historic data from 2015 to 2021 and forecasts until 2026 which makes the report an invaluable resource for industry executives, marketing, sales and product managers, consultants, analysts, and stakeholders looking for key industry data in readily accessible documents with clearly presented tables and graphs.

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How we have factored the effect of Covid-19 in our report:

All the reports that we list have been tracking the impact of COVID-19 on the market. Both upstream and downstream of the entire supply chain has been accounted for while doing this. Also, where possible, we will provide an additional COVID-19 update supplement/report to the report in Q3, please check for with the sales team.

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