Compressive Research on: 3D ICs Market 2021-Industry Outlook and Regional Insights Key Factors 2027

A three-dimensional integrated circuit (3D IC) is a metal-oxide-semiconductor integrated circuit produced by stacking silicon wafers or dies and interconnecting them vertically. 3D ICs are used as a single device to achieve performance improvements at reduced power and a smaller footprint. In 3D ICs, multiple layers of active electronic components are integrated horizontally and vertically on a single chip. They can be manufactured using various processes such as beam re-crystallization, wafer bonding, and solid-phase crystallization. 3D IC technologies are witnessing massive developments toward management issues related to restricted communications capacity, chip signaling, and memory latency.

High growth of electronics market has accelerated innovations such as three-dimensional ICs. Since there has been increase in trend of mobile, fast, compact, and easy to use of products, the global electronics industry is witnessing demand for systems with enhanced performance, optimized working, and minimal response. Similarly, semiconductor chip manufacturers are facing various challenges and constant pressure to enhance performances, while reducing chip sizes. Furthermore, 3D ICs with TSVs provide an enhanced electrical performance due to the very high number of TSV interconnections and short interconnects within stacked ICs. Hence, these factors are expected to drive growth of the global 3D ICs market during the forecast period.

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What is the current market size and Compound Annual Growth Rate (CAGR) of the market during the forecast period (2020-2027)?
The global 3D ICs market size was valued at US$ 7,521.4 million in 2019 and is estimated to exhibit a CAGR of 22.5% between 2020 and 2027.

Which are the key factors driving the growth of the 3D ICs market?
Major factor driving the growth of global 3D ICs market during the forecast period are Increasing demand for efficient solutions.

Who are the key players operating in this market?
Some of the key players operating in the market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.

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